- Polycrystalline Diamond Abrasive: Multiple fine cutting edges support precision polishing and controlled material removal.
- Hard Semiconductor Polishing: Suitable for fine mechanical polishing of SiC and selected other hard semiconductor substrates.
- Controlled Surface Refinement: Fine diamond grades support consistent abrasive action and surface finishing.
- Self-Sharpening Characteristics: Limited microfracture can expose additional cutting edges during polishing.
- Liquid Abrasive Delivery: Formulated for controlled application through compatible slurry-feeding systems.
- Customizable Formulation: Particle size, diamond concentration and carrier properties can be matched to customer requirements.
Polycrystalline Diamond Slurry
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
Polycrystalline Diamond Slurry (PCDS) is a precision polishing slurry formulated with fine polycrystalline diamond abrasives for high-quality surface finishing of hard and difficult-to-polish materials. Its polycrystalline structure provides multiple fine cutting edges for controlled material removal and surface refinement. Available in water- and oil-based formulations, PCDS is suited to fine polishing of SiC and other selected hard semiconductor substrates, sapphire and high-value crystalline components.
Features
Specifications
| Product Type | Polycrystalline Diamond Slurry |
|---|---|
| Product Series | PCDS |
| Abrasive Type | Polycrystalline Synthetic Diamond |
| Particle Structure | Multiple Fine Diamond Crystallites |
| Nominal Particle Size | 0.05–6 μm; see available grades below |
| Particle Size Distribution | Controlled according to the selected grade; PSD data available upon request |
| Carrier System | Water-Based / Oil-Based |
| Diamond Concentration | Customizable; specified in ct/L or wt% according to the supplied formulation |
| Viscosity | Adjustable according to dispensing and polishing requirements |
| Packaging | 500 mL / 1 L / 5 L / 25 L; custom volumes available upon request |
| Product Form | Liquid Diamond Polishing Slurry |
| Nominal Size | Water-Based Model | Oil-Based Model |
|---|---|---|
| 6 μm | PCDS-6U-W | PCDS-6U-O |
| 4 μm | PCDS-4U-W | PCDS-4U-O |
| 3 μm | PCDS-3U-W | PCDS-3U-O |
| 2 μm | PCDS-2U-W | PCDS-2U-O |
| 1 μm | PCDS-1U-W | PCDS-1U-O |
| 0.5 μm | PCDS-500N-W | PCDS-500N-O |
| 0.25 μm | PCDS-250N-W | PCDS-250N-O |
| 0.2 μm | PCDS-200N-W | PCDS-200N-O |
| 0.1 μm | PCDS-100N-W | PCDS-100N-O |
| 0.05 μm | PCDS-50N-W | PCDS-50N-O |
Applications
Semiconductor
Used for fine polishing of SiC and other hard semiconductor substrates.
- SiC wafer and substrate fine polishing
- Precision polishing of hard semiconductor samples
- Surface refinement of crystalline substrate materials
Optical & Optoelectronic
Used for precision polishing of sapphire and selected hard optical crystals.
- Sapphire substrate fine polishing
- Hard optical crystal surface finishing
- Precision optoelectronic component polishing
Metallographic Sample Preparation
Used for fine polishing of prepared material specimens before microscopic examination.
- Cemented carbide specimen polishing
- Prepared cross-section finishing
- Precision polishing of hard material samples