Polycrystalline Diamond Slurry

Polycrystalline Diamond Slurry

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
Polycrystalline Diamond Slurry (PCDS) is a precision polishing slurry formulated with fine polycrystalline diamond abrasives for high-quality surface finishing of hard and difficult-to-polish materials. Its polycrystalline structure provides multiple fine cutting edges for controlled material removal and surface refinement. Available in water- and oil-based formulations, PCDS is suited to fine polishing of SiC and other selected hard semiconductor substrates, sapphire and high-value crystalline components.

Features

  • Polycrystalline Diamond Abrasive: Multiple fine cutting edges support precision polishing and controlled material removal.
  • Hard Semiconductor Polishing: Suitable for fine mechanical polishing of SiC and selected other hard semiconductor substrates.
  • Controlled Surface Refinement: Fine diamond grades support consistent abrasive action and surface finishing.
  • Self-Sharpening Characteristics: Limited microfracture can expose additional cutting edges during polishing.
  • Liquid Abrasive Delivery: Formulated for controlled application through compatible slurry-feeding systems.
  • Customizable Formulation: Particle size, diamond concentration and carrier properties can be matched to customer requirements.

Specifications

Product Type Polycrystalline Diamond Slurry
Product Series PCDS
Abrasive Type Polycrystalline Synthetic Diamond
Particle Structure Multiple Fine Diamond Crystallites
Nominal Particle Size 0.05–6 μm; see available grades below
Particle Size Distribution Controlled according to the selected grade; PSD data available upon request
Carrier System Water-Based / Oil-Based
Diamond Concentration Customizable; specified in ct/L or wt% according to the supplied formulation
Viscosity Adjustable according to dispensing and polishing requirements
Packaging 500 mL / 1 L / 5 L / 25 L; custom volumes available upon request
Product Form Liquid Diamond Polishing Slurry
Nominal Size Water-Based Model Oil-Based Model
6 μm PCDS-6U-W PCDS-6U-O
4 μm PCDS-4U-W PCDS-4U-O
3 μm PCDS-3U-W PCDS-3U-O
2 μm PCDS-2U-W PCDS-2U-O
1 μm PCDS-1U-W PCDS-1U-O
0.5 μm PCDS-500N-W PCDS-500N-O
0.25 μm PCDS-250N-W PCDS-250N-O
0.2 μm PCDS-200N-W PCDS-200N-O
0.1 μm PCDS-100N-W PCDS-100N-O
0.05 μm PCDS-50N-W PCDS-50N-O

Applications

Semiconductor

Used for fine polishing of SiC and other hard semiconductor substrates.

  • SiC wafer and substrate fine polishing
  • Precision polishing of hard semiconductor samples
  • Surface refinement of crystalline substrate materials
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Optical & Optoelectronic

Used for precision polishing of sapphire and selected hard optical crystals.

  • Sapphire substrate fine polishing
  • Hard optical crystal surface finishing
  • Precision optoelectronic component polishing
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Metallographic Sample Preparation

Used for fine polishing of prepared material specimens before microscopic examination.

  • Cemented carbide specimen polishing
  • Prepared cross-section finishing
  • Precision polishing of hard material samples
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