Polycrystalline Diamond Paste

20+ Years Experience Consistent Batch Quality Customized Solutions

Product Overview

Polycrystalline Diamond Paste is a precision polishing compound formulated with fine polycrystalline diamond abrasives for high-quality surface finishing of hard and difficult-to-polish materials. Its polycrystalline structure provides multiple fine cutting edges for controlled material removal and surface refinement. The paste is suitable for fine polishing of SiC and other selected semiconductor substrates, as well as sapphire, advanced ceramics and cemented carbides.

Features

Polycrystalline Diamond Structure: Multiple fine crystallites provide numerous cutting edges for controlled abrasive action.
Fine Polishing of Hard Substrates: Suitable for precision surface finishing of SiC and selected other hard semiconductor materials.
Controlled Surface Refinement: Multiple cutting edges support fine material removal and consistent surface finishing.
Self-Sharpening Characteristics:
Microfracture can expose fresh cutting edges
during polishing.
Selected Micron Grades: Fine particle sizes can be matched to different polishing stages and surface finish requirements.
Customizable Formulation: Diamond concentration and water- or oil-based carrier options can be selected according to application requirements.

Specifications

Product Type	Polycrystalline Diamond Polishing Paste
Abrasive Type	Polycrystalline Synthetic Diamond
Particle Structure	Multiple Fine Diamond Crystallites
Available Particle Size	Selected Micron Grades, up to 12 μm
Particle Size Distribution	Controlled according to selected grade
Base Medium	Water-Based / Oil-Based
Concentration Options	Light / Medium / Heavy; customized diamond concentration available upon request
Primary Application	Fine and Precision Polishing of Hard Semiconductor Substrates and Other Hard Materials
Product Form	Ready-to-Use Polishing Paste
Selection Focus	Particle size, particle size distribution, diamond concentration, carrier type and target surface finish

Binder Type:
- Water-Based Polycrystalline Diamond Paste: Preferred for semiconductor, optical, and ceramic applications, offering fast cooling, easy cleaning, and no oily residue for clean processes.
- Oil-Based Polycrystalline Diamond Paste: Provides enhanced lubrication for soft or sticky metals, supports extended polishing time, and offers rust protection, with post-polishing cleaning recommended.

Polycrystalline Diamond Paste Particle Size Chart

Particle Size (μm)	Reference Mesh / Grit No. (#)	Reference W Grade	Reference D50 (μm)	Suggested Polishing Stage
5–10	2000#	W10	6.5–7.3	Precision Polishing
4–8	3000#	W7	5.0–6.0	Precision Polishing
3–6	4000#	W5	3.5–4.5	Fine Polishing
2–4	6000#	W3.5	2.2–2.6	Fine Polishing
1–3	10000#	W2.5	1.6–1.8	Ultra-Fine / Mirror Polishing
1–2	12000#	W1.5	1.1–1.3
0–1	15000#	W1.0	0.6–0.8
0–0.5	30000#	W0.5	0.2–0.3

Note: Grit numbers, W grades and D50 values are for reference. Custom particle sizes and formulations are available upon request.

Applications

Semiconductor

Used for fine mechanical polishing of SiC and other selected hard semiconductor substrates where controlled material removal and surface quality are important.