- Polycrystalline Microstructure: Fine, randomly oriented diamond crystallites provide multiple active cutting points.
- Progressive Micro-Fracturing: Generates new abrasive edges during use and supports sustained cutting efficiency.
- Multi-Contact Particle Surface: Promotes efficient and relatively uniform material removal during lapping and polishing.
- Self-Renewing Abrasive Behavior: Helps maintain stable removal performance throughout extended processing cycles.
- Controlled Fine Particle Sizes: Supports precision finishing where removal rate and surface quality must be balanced.
PLDM – Polycrystalline Diamond Powder
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
PLDM is a polycrystalline diamond powder developed for precision lapping and polishing applications requiring high material removal efficiency together with controlled surface quality. Its polycrystalline structure consists of fine, randomly oriented diamond crystallites, providing multiple cutting points and progressive micro-fracturing during use. This self-renewing abrasive behavior supports stable removal rates and consistent finishing of sapphire, advanced ceramics, semiconductor-related materials and optical components.
Features
Specifications
| Diamond Type | Polycrystalline Synthetic Diamond |
|---|---|
| Product Series | Specialty Micron Diamond Powder |
| Grade | PLDM |
| Structure | Polycrystalline aggregate of fine diamond crystallites |
| Fracture Behavior | Progressive micro-fracturing / self-renewing |
| Particle Surface | Rough, multi-edge morphology |
| Selection Focus | High removal efficiency, self-sharpening and surface control |
| Typical Processes | Precision Lapping / Polishing / Back Thinning |
| Model | D10 (µm) | D50 (µm) | D95 (µm) | Application |
|---|---|---|---|---|
| PLDM 1/8 | ≥0.06 | 0.10–0.14 | ≤0.21 | End surface polishing of optical crystal, ultra-hard ceramic, wafer substrate, and metal. |
| PLDM 1/4 | ≥0.11 | 0.20–0.25 | ≤0.40 | |
| PLDM 0-1 | ≥0.40 | 0.48–0.55 | ≤0.72 | |
| PLDM 0-2 | ≥0.70 | 0.90–1.10 | ≤1.50 | |
| PLDM 2-4 | ≥1.80 | 2.70–3.00 | ≤4.50 | Lapping, rough polishing, and back thinning of sapphire and wafer substrate. |
| PLDM 3-6 | ≥2.80 | 4.00–4.40 | ≤7.00 | |
| PLDM 4-8 | ≥4.00 | 5.50–6.00 | ≤8.60 | |
| PLDM 5-9 | ≥4.70 | 6.30–7.00 | ≤10.00 | |
| PLDM 5-12 | ≥5.20 | 7.20–7.80 | ≤13.00 |
Applications
Semiconductor Materials
Suitable for controlled lapping and polishing of hard semiconductor-related substrates.
- Sapphire substrate lapping and polishing
- SiC surface preparation
- Wafer back thinning and pre-polishing
Optics, Glass & Sapphire
Provides multi-edge abrasive action for precision surface finishing.
- Optical glass polishing
- Sapphire surface finishing
- Optical crystal lapping and polishing