PLDM – Polycrystalline Diamond Powder

PLDM – Polycrystalline Diamond Powder

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
PLDM is a polycrystalline diamond powder developed for precision lapping and polishing applications requiring high material removal efficiency together with controlled surface quality. Its polycrystalline structure consists of fine, randomly oriented diamond crystallites, providing multiple cutting points and progressive micro-fracturing during use. This self-renewing abrasive behavior supports stable removal rates and consistent finishing of sapphire, advanced ceramics, semiconductor-related materials and optical components.

Features

  • Polycrystalline Microstructure: Fine, randomly oriented diamond crystallites provide multiple active cutting points.
  • Progressive Micro-Fracturing: Generates new abrasive edges during use and supports sustained cutting efficiency.
  • Multi-Contact Particle Surface: Promotes efficient and relatively uniform material removal during lapping and polishing.
  • Self-Renewing Abrasive Behavior: Helps maintain stable removal performance throughout extended processing cycles.
  • Controlled Fine Particle Sizes: Supports precision finishing where removal rate and surface quality must be balanced.

Specifications

Diamond Type Polycrystalline Synthetic Diamond
Product Series Specialty Micron Diamond Powder
Grade PLDM
Structure Polycrystalline aggregate of fine diamond crystallites
Fracture Behavior Progressive micro-fracturing / self-renewing
Particle Surface Rough, multi-edge morphology
Selection Focus High removal efficiency, self-sharpening and surface control
Typical Processes Precision Lapping / Polishing / Back Thinning
Model D10 (µm) D50 (µm) D95 (µm) Application
PLDM 1/8 ≥0.06 0.10–0.14 ≤0.21 End surface polishing of optical crystal,
ultra-hard ceramic,
wafer substrate,
and metal.
PLDM 1/4 ≥0.11 0.20–0.25 ≤0.40
PLDM 0-1 ≥0.40 0.48–0.55 ≤0.72
PLDM 0-2 ≥0.70 0.90–1.10 ≤1.50
PLDM 2-4 ≥1.80 2.70–3.00 ≤4.50 Lapping,
rough polishing,
and back thinning of sapphire
and wafer substrate.
PLDM 3-6 ≥2.80 4.00–4.40 ≤7.00
PLDM 4-8 ≥4.00 5.50–6.00 ≤8.60
PLDM 5-9 ≥4.70 6.30–7.00 ≤10.00
PLDM 5-12 ≥5.20 7.20–7.80 ≤13.00

Applications

Semiconductor Materials

Suitable for controlled lapping and polishing of hard semiconductor-related substrates.

  • Sapphire substrate lapping and polishing
  • SiC surface preparation
  • Wafer back thinning and pre-polishing
Read More

Optics, Glass & Sapphire

Provides multi-edge abrasive action for precision surface finishing.

  • Optical glass polishing
  • Sapphire surface finishing
  • Optical crystal lapping and polishing
Read More

Inquiry Now

Submitting...

We normally respond within 24 hours.

Chat with us on WhatsApp