GCDMZ – Reshaped Micron Diamond Powder

GCDMZ – Reshaped Micron Diamond Powder

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
GCDMZ is a reshaped monocrystalline micron diamond powder developed for precision lapping and polishing applications requiring controlled particle morphology, uniform abrasive contact and stable surface quality. Through additional shaping and classification, its particles exhibit reduced angularity and more consistent geometry than conventional crushed micron diamond, supporting controlled material removal and improved surface consistency on optical glass, sapphire, advanced ceramics and other hard materials.

Features

  • Reshaped Particle Morphology: Reduced angularity provides more controlled abrasive contact during lapping and polishing.
  • Improved Shape Consistency: Supports more uniform material removal and stable processing behavior.
  • Controlled Cutting Action: Helps reduce variation in abrasive penetration and supports consistent surface quality.
  • Controlled Particle Size Distribution: Supports repeatable lapping and polishing results across precision applications.
Customized Grades:
For precision and high-surface-quality applications, GCDMZ can be supplied with more rounded or near-spherical morphology, tighter PSD and oversize control, and enhanced purity according to specific process requirements.

Specifications

Diamond Type HPHT Monocrystalline Micron Diamond
Product Series Specialty Monocrystalline Micron Diamond Powder
Grade GCDMZ
Grade Direction Reshaped / Controlled Morphology Grade
Particle Morphology Reshaped, reduced-angularity monocrystalline particles
Shape Consistency Improved compared with conventional angular micron diamond
Selection Focus Uniform abrasive contact, stable removal and surface control
Typical Processes Precision Lapping / Polishing / Surface Finishing

Comparison Table of Micron Diamond Powder Particle Size

China Grade
Industry Reference
Nominal Size Range
(μm)
Mesh Reference
(#)
Typical D50
(μm)
W0.2 0–0.2 80000 0.1
W0.25 0–0.25 60000 0.11–0.20
W0.5 0–0.5 30000 0.20–0.30
W1 0–1 15000 0.6–0.8
W1.5- 0–2 13000 1.0
W1.5 1–2 12000 1.1–1.3
W2.5 1–3 10000 1.6–1.8
W3 2–3 7000 1.9–2.1
W3.5- 2–4 6500 2.2–2.6
W3.5 2–4 6000 2.6–3.0
W4 2–5 5000 3.1–3.4
W5 3–6 4000 3.5–4.5
W6 4–6 3500 4.4–5.0
W7 4–8 3000 5.0–6.0
W10- 4–9 2500 6.1–6.5
W10 5–10 2000 6.5–7.3
W10+ 6–12 1800 7.3–8.3
W12 8–12 1600 8.3–9.0
W14- 7–14 1500 9.1–10.5
W14 8–16 1300 10.0–12.0
W20- 10–20 1200 12.5–15.0
W20 12–22 1000 15.0–17.0
W20+ 15–25 800 18.0–20.0
W28 20–30 700 20–23
W28+ 22–36 600 23–26
W40- 20–40 500 26–29
W40 30–40 450 29–32
W40+ 35–45 400 32–36
W50 36–54 320 37–43
325/400 Mesh 320 43–48
270/325 Mesh 280 48–55
230/270 Mesh 240 56–64
200/230 Mesh 200 65–73


View the Diamond Powder Particle Size Guide →

Applications

Optics, Glass & Sapphire

Designed for precision lapping and polishing where controlled abrasive contact and surface consistency are important.

  • Optical glass lapping and polishing
  • Sapphire surface finishing
  • Precision polishing of crystal materials
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Semiconductor Materials

Suitable for lapping and surface preparation of hard semiconductor-related materials requiring controlled removal.

  • Sapphire substrate lapping
  • Silicon carbide surface preparation
  • Precision substrate pre-polishing
Read More

Advanced Ceramic Lapping & Polishing

Provides controlled abrasive action for precision finishing of hard and brittle ceramic materials

  • Technical ceramic lapping
  • Precision component polishing
  • Controlled surface finishing
Read More

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