| Diamond Type | HPHT Monocrystalline Micron Diamond |
|---|---|
| Product Series | Monocrystalline Micron Diamond Powder |
| Grade | GCDM10 |
| Grade Direction | Resin-Bond Grade / Balanced Performance |
| Relative Crystal Strength | Medium |
| Friability | Controlled |
| Particle Morphology | Angular to blocky monocrystalline particles |
| Selection Focus | Balanced removal rate, abrasive renewal and surface quality |
| Typical Processes | Lapping / Polishing / Resin-Bond Precision Tools |
|
China Grade Industry Reference |
Nominal Size Range (μm) |
Mesh Reference (#) |
Typical D50 (μm) |
|---|---|---|---|
| W0.2 | 0–0.2 | 80000 | 0.1 |
| W0.25 | 0–0.25 | 60000 | 0.11–0.20 |
| W0.5 | 0–0.5 | 30000 | 0.20–0.30 |
| W1 | 0–1 | 15000 | 0.6–0.8 |
| W1.5- | 0–2 | 13000 | 1.0 |
| W1.5 | 1–2 | 12000 | 1.1–1.3 |
| W2.5 | 1–3 | 10000 | 1.6–1.8 |
| W3 | 2–3 | 7000 | 1.9–2.1 |
| W3.5- | 2–4 | 6500 | 2.2–2.6 |
| W3.5 | 2–4 | 6000 | 2.6–3.0 |
| W4 | 2–5 | 5000 | 3.1–3.4 |
| W5 | 3–6 | 4000 | 3.5–4.5 |
| W6 | 4–6 | 3500 | 4.4–5.0 |
| W7 | 4–8 | 3000 | 5.0–6.0 |
| W10- | 4–9 | 2500 | 6.1–6.5 |
| W10 | 5–10 | 2000 | 6.5–7.3 |
| W10+ | 6–12 | 1800 | 7.3–8.3 |
| W12 | 8–12 | 1600 | 8.3–9.0 |
| W14- | 7–14 | 1500 | 9.1–10.5 |
| W14 | 8–16 | 1300 | 10.0–12.0 |
| W20- | 10–20 | 1200 | 12.5–15.0 |
| W20 | 12–22 | 1000 | 15.0–17.0 |
| W20+ | 15–25 | 800 | 18.0–20.0 |
| W28 | 20–30 | 700 | 20–23 |
| W28+ | 22–36 | 600 | 23–26 |
| W40- | 20–40 | 500 | 26–29 |
| W40 | 30–40 | 450 | 29–32 |
| W40+ | 35–45 | 400 | 32–36 |
| W50 | 36–54 | 320 | 37–43 |
| 325/400 Mesh | — | 320 | 43–48 |
| 270/325 Mesh | — | 280 | 48–55 |
| 230/270 Mesh | — | 240 | 56–64 |
| 200/230 Mesh | — | 200 | 65–73 |
Used for grinding and polishing of stone and construction materials with resin bond diamond tools.
Suitable for controlled material removal and surface finishing of cemented carbide components.
Suitable for bonded tools requiring a balance of cutting action and abrasive life.
