GCDM20 – Metal-Bond Grade Micron Diamond Powder

GCDM20 – Metal-Bond Grade Micron Diamond Powder

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
GCDM20 is a higher-strength monocrystalline micron diamond powder developed for precision lapping, polishing and metal-bond abrasive applications requiring stable particle geometry, controlled wear and longer abrasive life. Its regular blocky morphology and lower friability provide improved particle stability during extended processing of cemented carbide, advanced ceramics, sapphire and other hard materials.

Features

  • Higher Crystal Strength:
    Provides improved particle stability during extended processing cycles.
  • Regular Blocky Morphology:
    Supports stable abrasive contact and predictable material removal.
  • Lower Friability:
    Helps maintain particle geometry under sustained lapping and bonded-tool conditions.
  • Controlled PSD and Oversize:
    Supports consistent cutting depth and improved surface control.

Specifications

Diamond Type HPHT Monocrystalline Micron Diamond
Product Series Monocrystalline Micron Diamond Powder
Grade GCDM20
Grade Direction Metal-Bond Grade / Higher-Strength Grade
Relative Crystal Strength High
Friability Low to Controlled
Particle Morphology Regular blocky monocrystalline particles
Selection Focus Particle stability, controlled wear and abrasive life
Typical Processes Precision Lapping / Polishing / Metal-Bond Precision Tools

Comparison Table of Micron Diamond Powder Particle Size

China Grade
Industry Reference
Nominal Size Range
(μm)
Mesh Reference
(#)
Typical D50
(μm)
W0.2 0–0.2 80000 0.1
W0.25 0–0.25 60000 0.11–0.20
W0.5 0–0.5 30000 0.20–0.30
W1 0–1 15000 0.6–0.8
W1.5- 0–2 13000 1.0
W1.5 1–2 12000 1.1–1.3
W2.5 1–3 10000 1.6–1.8
W3 2–3 7000 1.9–2.1
W3.5- 2–4 6500 2.2–2.6
W3.5 2–4 6000 2.6–3.0
W4 2–5 5000 3.1–3.4
W5 3–6 4000 3.5–4.5
W6 4–6 3500 4.4–5.0
W7 4–8 3000 5.0–6.0
W10- 4–9 2500 6.1–6.5
W10 5–10 2000 6.5–7.3
W10+ 6–12 1800 7.3–8.3
W12 8–12 1600 8.3–9.0
W14- 7–14 1500 9.1–10.5
W14 8–16 1300 10.0–12.0
W20- 10–20 1200 12.5–15.0
W20 12–22 1000 15.0–17.0
W20+ 15–25 800 18.0–20.0
W28 20–30 700 20–23
W28+ 22–36 600 23–26
W40- 20–40 500 26–29
W40 30–40 450 29–32
W40+ 35–45 400 32–36
W50 36–54 320 37–43
325/400 Mesh 320 43–48
270/325 Mesh 280 48–55
230/270 Mesh 240 56–64
200/230 Mesh 200 65–73


View the Diamond Powder Particle Size Guide →

Applications

Advanced Ceramic Lapping & Polishing

Provides stable abrasive performance for high-hardness ceramic materials.

  • Technical ceramic lapping
  • Precision surface finishing
  • Hard ceramic polishing
Read More

Optics, Glass & Sapphire

Suitable for controlled material removal and surface refinement of brittle optical materials.

  • Optical glass lapping
  • Sapphire surface preparation
  • Crystal material polishing
Read More

Metal-Bond Precision Tools

Suitable for bonded tools requiring stronger diamond particles and controlled abrasive wear.

  • Metal-bond fine-grit wheels
  • Precision abrasive tools
  • Selected vitrified diamond tools
Read More

Inquiry Now

Submitting...

We normally respond within 24 hours.

Chat with us on WhatsApp