-
Higher Crystal Strength:
Provides improved particle stability during extended processing cycles. -
Regular Blocky Morphology:
Supports stable abrasive contact and predictable material removal. -
Lower Friability:
Helps maintain particle geometry under sustained lapping and bonded-tool conditions. -
Controlled PSD and Oversize:
Supports consistent cutting depth and improved surface control.
GCDM20 – Metal-Bond Grade Micron Diamond Powder
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
GCDM20 is a higher-strength monocrystalline micron diamond powder developed for precision lapping, polishing and metal-bond abrasive applications requiring stable particle geometry, controlled wear and longer abrasive life. Its regular blocky morphology and lower friability provide improved particle stability during extended processing of cemented carbide, advanced ceramics, sapphire and other hard materials.
Features
Specifications
| Diamond Type | HPHT Monocrystalline Micron Diamond |
|---|---|
| Product Series | Monocrystalline Micron Diamond Powder |
| Grade | GCDM20 |
| Grade Direction | Metal-Bond Grade / Higher-Strength Grade |
| Relative Crystal Strength | High |
| Friability | Low to Controlled |
| Particle Morphology | Regular blocky monocrystalline particles |
| Selection Focus | Particle stability, controlled wear and abrasive life |
| Typical Processes | Precision Lapping / Polishing / Metal-Bond Precision Tools |
Comparison Table of Micron Diamond Powder Particle Size
|
China Grade Industry Reference |
Nominal Size Range (μm) |
Mesh Reference (#) |
Typical D50 (μm) |
|---|---|---|---|
| W0.2 | 0–0.2 | 80000 | 0.1 |
| W0.25 | 0–0.25 | 60000 | 0.11–0.20 |
| W0.5 | 0–0.5 | 30000 | 0.20–0.30 |
| W1 | 0–1 | 15000 | 0.6–0.8 |
| W1.5- | 0–2 | 13000 | 1.0 |
| W1.5 | 1–2 | 12000 | 1.1–1.3 |
| W2.5 | 1–3 | 10000 | 1.6–1.8 |
| W3 | 2–3 | 7000 | 1.9–2.1 |
| W3.5- | 2–4 | 6500 | 2.2–2.6 |
| W3.5 | 2–4 | 6000 | 2.6–3.0 |
| W4 | 2–5 | 5000 | 3.1–3.4 |
| W5 | 3–6 | 4000 | 3.5–4.5 |
| W6 | 4–6 | 3500 | 4.4–5.0 |
| W7 | 4–8 | 3000 | 5.0–6.0 |
| W10- | 4–9 | 2500 | 6.1–6.5 |
| W10 | 5–10 | 2000 | 6.5–7.3 |
| W10+ | 6–12 | 1800 | 7.3–8.3 |
| W12 | 8–12 | 1600 | 8.3–9.0 |
| W14- | 7–14 | 1500 | 9.1–10.5 |
| W14 | 8–16 | 1300 | 10.0–12.0 |
| W20- | 10–20 | 1200 | 12.5–15.0 |
| W20 | 12–22 | 1000 | 15.0–17.0 |
| W20+ | 15–25 | 800 | 18.0–20.0 |
| W28 | 20–30 | 700 | 20–23 |
| W28+ | 22–36 | 600 | 23–26 |
| W40- | 20–40 | 500 | 26–29 |
| W40 | 30–40 | 450 | 29–32 |
| W40+ | 35–45 | 400 | 32–36 |
| W50 | 36–54 | 320 | 37–43 |
| 325/400 Mesh | — | 320 | 43–48 |
| 270/325 Mesh | — | 280 | 48–55 |
| 230/270 Mesh | — | 240 | 56–64 |
| 200/230 Mesh | — | 200 | 65–73 |
Applications
Advanced Ceramic Lapping & Polishing
Provides stable abrasive performance for high-hardness ceramic materials.
- Technical ceramic lapping
- Precision surface finishing
- Hard ceramic polishing
Optics, Glass & Sapphire
Suitable for controlled material removal and surface refinement of brittle optical materials.
- Optical glass lapping
- Sapphire surface preparation
- Crystal material polishing
Metal-Bond Precision Tools
Suitable for bonded tools requiring stronger diamond particles and controlled abrasive wear.
- Metal-bond fine-grit wheels
- Precision abrasive tools
- Selected vitrified diamond tools