GCDM30 – Electroplating-Grade Micron Diamond Powder

GCDM30 – Electroplating-Grade Micron Diamond Powder

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Product Overview
GCDM30 is a high-quality monocrystalline micron diamond powder specifically developed for electroplated diamond tools and other high-load grinding systems. Produced from high-toughness HPHT synthetic diamond through controlled crushing and milling, this grade features blocky crystal morphology, narrow particle size distribution, and ultra-low impurity content, delivering strong grain retention, stable cutting performance, and excellent surface finish in precision grinding and polishing applications.

Features

  • High Particle Integrity:
    Helps maintain stable abrasive geometry during precision processing.
  • Controlled Blocky Morphology:
    Supports uniform abrasive contact and stable grit exposure in electroplated tools.
  • Concentrated Particle Size Distribution:
    Promotes consistent cutting depth and repeatable surface quality.
  • Stable Wear Behavior:
    Supports reliable performance during extended lapping, polishing and precision tool use.

Specifications

Diamond Type HPHT Monocrystalline Micron Diamond
Product Series Monocrystalline Micron Diamond Powder
Grade GCDM30
Grade Direction Electroplating Grade / High-Integrity Grade
Relative Crystal Strength High
Friability Low to Controlled
Particle Morphology Well-developed blocky monocrystalline particles
Selection Focus Particle integrity, stable geometry and surface consistency
Typical Processes Precision Lapping / Polishing / Electroplated Precision Tools

Comparison Table of Micron Diamond Powder Particle Size

China Grade
Industry Reference
Nominal Size Range
(μm)
Mesh Reference
(#)
Typical D50
(μm)
W0.2 0–0.2 80000 0.1
W0.25 0–0.25 60000 0.11–0.20
W0.5 0–0.5 30000 0.20–0.30
W1 0–1 15000 0.6–0.8
W1.5- 0–2 13000 1.0
W1.5 1–2 12000 1.1–1.3
W2.5 1–3 10000 1.6–1.8
W3 2–3 7000 1.9–2.1
W3.5- 2–4 6500 2.2–2.6
W3.5 2–4 6000 2.6–3.0
W4 2–5 5000 3.1–3.4
W5 3–6 4000 3.5–4.5
W6 4–6 3500 4.4–5.0
W7 4–8 3000 5.0–6.0
W10- 4–9 2500 6.1–6.5
W10 5–10 2000 6.5–7.3
W10+ 6–12 1800 7.3–8.3
W12 8–12 1600 8.3–9.0
W14- 7–14 1500 9.1–10.5
W14 8–16 1300 10.0–12.0
W20- 10–20 1200 12.5–15.0
W20 12–22 1000 15.0–17.0
W20+ 15–25 800 18.0–20.0
W28 20–30 700 20–23
W28+ 22–36 600 23–26
W40- 20–40 500 26–29
W40 30–40 450 29–32
W40+ 35–45 400 32–36
W50 36–54 320 37–43
325/400 Mesh 320 43–48
270/325 Mesh 280 48–55
230/270 Mesh 240 56–64
200/230 Mesh 200 65–73


View the Diamond Powder Particle Size Guide →

Applications

Semiconductor Material Lapping & Surface Preparation

Suitable for hard semiconductor-related substrates requiring stable abrasive behavior.

  • Sapphire substrate lapping
  • Silicon carbide surface preparation
  • Precision substrate pre-polishing
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Optics, Glass & Sapphire

Provides controlled abrasive interaction for precision surface finishing.

  • Optical glass lapping
  • Sapphire polishing
  • Crystal material surface finishing
Read More

Electroplated Precision Tools

Suitable for fine-grit tools requiring controlled particle geometry and stable abrasive exposure.

  • Electroplated precision wheels
  • Fine profiling tools
  • Specialty abrasive tools
Read More

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