- Micron and Nano Particle Sizes: Available from 50 nm to 50 μm for fine thermal composite formulations.
- Enhanced Cleanliness: Higher cleanliness than standard micron diamond grades for functional thermal applications.
- Controlled Particle Size Distribution: Supports stable dispersion and consistent formulation performance.
- Good Particle Uniformity: Controlled fine-particle quality supports repeatable batch performance.
- Good Dispersion Characteristics: Suitable for polymers, resins, adhesives, greases and related matrices.
- Flexible Fine-Filler Selection: Different micron and nano grades can be selected according to formulation and bond-line requirements.
WTCD – Micron Thermal Conductive Diamond
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
WTCD is a high-cleanliness micron and nano thermal conductive diamond powder available from 50 nm to 50 μm. With controlled particle size distribution, enhanced cleanliness and stable particle quality, it is designed for thermal interface materials, polymers, resins, adhesives and other fine-particle thermal composites requiring reliable dispersion and formulation consistency.
Features
Specifications
| Material Type | Fine Synthetic Diamond Powder |
|---|---|
| Product Series | Thermal Conductive Diamond |
| Grade | WTCD |
| Grade Direction | Micron / Nano Thermal Conductive Diamond |
| Particle Size Range | 50 nm–50 μm |
| Particle Size Distribution | Controlled; customized sizes available |
| Cleanliness | Enhanced compared with standard micron diamond grades |
| Selection Focus | PSD, cleanliness, dispersion and matrix compatibility |
| Typical Matrix Systems | Polymer / Epoxy / Resin / Adhesive / Grease |
Applications
Thermal Management
Used as a fine thermal filler in interface materials and heat-transfer formulations.
- Thermal greases and adhesives
- Gap fillers and thermal interface pads
- Heat-transfer coatings and thin thermal layers
Semiconductor
Used in thermal formulations for electronic packaging and high-density devices.
- Chip packaging and encapsulation materials
- Power-device thermal compounds
- Electronic heat-dissipation materials
Diamond Composites
Used in polymer and resin systems requiring fine, uniformly dispersed thermal fillers.
- Thermally conductive polymers and resins
- Epoxy and encapsulation composites
- Functional thermal coatings and composite layers