MTCD – Monocrystalline Thermally Conductive Diamond

MTCD – Monocrystalline Thermally Conductive Diamond

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Product Overview
MTCD is a selected monocrystalline thermal diamond grit available from 20/25 to 500/600 mesh. Featuring controlled blocky crystal morphology, good particle integrity and selected thermal-grade quality, it is primarily designed for copper–diamond, aluminium–diamond and other thermal composites requiring coarse diamond particles for efficient heat spreading.

Features

  • Monocrystalline Diamond Structure: Selected single-crystal diamond for stable thermal and mechanical performance.
  • Controlled Blocky Morphology: Regular crystal shape supports consistent packing and composite processing.
  • Good Particle Integrity: Selected grains maintain crystal integrity during composite preparation.
  • Thermal-Grade Quality: Controlled crystal quality and impurity level for thermal composite applications.
  • Wide Mesh Size Range: Available from 20/25 to 500/600 mesh for different composite designs.
  • Suitable for Interface Engineering: Can be supplied for subsequent TiC, W and other surface treatments according to matrix requirements.

Specifications

Material Type Monocrystalline Synthetic Diamond
Product Series Thermal Conductive Diamond
Grade MTCD
Grade Direction Mesh Thermal Conductive Diamond
Crystal Structure Monocrystalline
Crystal Morphology Selected Blocky / Regular Crystals
Available Grit Sizes 20/25–500/600 Mesh
Selection Focus Crystal quality, particle size, morphology and interface design
Typical Matrix Systems Copper / Aluminium / Metal-Matrix Composites

Applications

Thermal Management

Used in coarse-particle heat-spreading composites.

  • Heat spreaders
  • Thermal substrates
  • Power electronic cooling
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Diamond Composites

Used primarily in metal-matrix thermal composites.

  • Copper–diamond composites
  • Aluminium–diamond composites
  • Thermal composite components
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Semiconductor

Used in thermal materials for high-power electronic devices.

  • Power-device heat spreading
  • Electronic packaging
  • Semiconductor cooling components
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