- Monocrystalline Diamond Structure: Selected single-crystal diamond for stable thermal and mechanical performance.
- Controlled Blocky Morphology: Regular crystal shape supports consistent packing and composite processing.
- Good Particle Integrity: Selected grains maintain crystal integrity during composite preparation.
- Thermal-Grade Quality: Controlled crystal quality and impurity level for thermal composite applications.
- Wide Mesh Size Range: Available from 20/25 to 500/600 mesh for different composite designs.
- Suitable for Interface Engineering: Can be supplied for subsequent TiC, W and other surface treatments according to matrix requirements.
MTCD – Monocrystalline Thermally Conductive Diamond
20+ Years Experience
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Product Overview
MTCD is a selected monocrystalline thermal diamond grit available from 20/25 to 500/600 mesh. Featuring controlled blocky crystal morphology, good particle integrity and selected thermal-grade quality, it is primarily designed for copper–diamond, aluminium–diamond and other thermal composites requiring coarse diamond particles for efficient heat spreading.
Features
Specifications
| Material Type | Monocrystalline Synthetic Diamond |
|---|---|
| Product Series | Thermal Conductive Diamond |
| Grade | MTCD |
| Grade Direction | Mesh Thermal Conductive Diamond |
| Crystal Structure | Monocrystalline |
| Crystal Morphology | Selected Blocky / Regular Crystals |
| Available Grit Sizes | 20/25–500/600 Mesh |
| Selection Focus | Crystal quality, particle size, morphology and interface design |
| Typical Matrix Systems | Copper / Aluminium / Metal-Matrix Composites |
Applications
Thermal Management
Used in coarse-particle heat-spreading composites.
- Heat spreaders
- Thermal substrates
- Power electronic cooling
Diamond Composites
Used primarily in metal-matrix thermal composites.
- Copper–diamond composites
- Aluminium–diamond composites
- Thermal composite components
Semiconductor
Used in thermal materials for high-power electronic devices.
- Power-device heat spreading
- Electronic packaging
- Semiconductor cooling components