ETCD – Etched Thermal Conductive Diamond

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Product Overview

ETCD is a surface-etched thermal conductive diamond grade designed to improve diamond–matrix interaction in thermal composites. Controlled surface texturing increases available interfacial contact and supports mechanical interlocking, making it suitable for metal, polymer and other composite systems where interface engineering is important.

Features

Controlled Surface-Etched Morphology: Creates a more textured diamond surface for interface-focused composite applications.
Increased Interfacial Contact: Provides a more developed surface for interaction between diamond particles and the surrounding matrix.
Improved Mechanical Interlocking: Surface texture supports physical anchoring within selected metal, polymer and composite matrices.
Suitable for Further Interface Engineering: Can be used as a base for selected coating, metallization or carbide-forming interface treatments.
Selected Thermal-Grade Diamond Core: Retains the thermal and mechanical characteristics required for thermal composite development.
Controlled Particle Size Range: Available for different thermal composite structures and manufacturing requirements.

Specifications

Material Type	Surface-Etched Synthetic Diamond
Product Series	Thermal Conductive Diamond
Grade	ETCD
Grade Direction	Surface-Engineered / Interface-Focused Grade
Surface Condition	Controlled Etched / Textured Surface
Particle Size Range	30–540 µm
Interface Direction	Enhanced contact and mechanical interlocking
Selection Focus	Matrix interaction, surface condition, particle size and interface design
Typical Matrix Systems	Metal / Polymer / Resin Composite Systems