STCD – Spherical Thermal Conductive Diamond

STCD – Spherical Thermal Conductive Diamond

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Product Overview

STCD is a rounded to near-spherical thermal conductive diamond grade developed for composite systems requiring good flowability, efficient particle packing and stable formulation behavior. Its controlled morphology makes it suitable for polymer, resin and selected metal-matrix thermal composites where filler loading and processing consistency are important.

Features

Rounded / Near-Spherical Morphology: Provides controlled particle shape for more consistent composite formulation and processing.
Good Flowability: Supports powder handling, mixing and filling in high-loading composite systems.
Efficient Packing Behavior: Suitable for formulations where particle packing density and filler loading are important.
Controlled Particle Size Distribution: Helps maintain stable formulation behavior and batch-to-batch consistency.
Selected Thermal-Grade Diamond: Provides a high-conductivity diamond filler phase for thermal composite development.
Wide Particle Size Range: Supports different matrix systems, filler-loading strategies and multimodal particle designs.

Specifications

Material Type	Thermal-Grade Synthetic Diamond
Product Series	Thermal Conductive Diamond
Grade	STCD
Grade Direction	Rounded / Near-Spherical Thermal Filler Grade
Particle Morphology	Rounded to Near-Spherical
Particle Size Range	20–600 µm
Particle Size Distribution	Controlled; customized distributions available
Selection Focus	Flowability, packing behavior, filler loading and particle-size design
Typical Matrix Systems	Polymer / Resin / Metal-Matrix Composites