PLLM – Polycrystalline-like Diamond Powder

20+ Years Experience Consistent Batch Quality Customized Solutions

Product Overview

PLLM is a polycrystalline-like diamond micron powder developed as a cost-effective alternative for lapping and polishing processes that benefit from self-renewing abrasive action. Through controlled particle morphology and micro-fracture behavior, PLLM provides multiple active cutting points and progressive edge renewal, helping balance material removal efficiency, surface quality and processing cost.

Features

Polycrystalline-Like Abrasive Behavior:
Engineered particle morphology and fracture behavior provide multiple active cutting points.
Controlled Self-Sharpening:
Progressive micro-fracturing renews abrasive edges during use.
Multi-Edge Particle Morphology:
Supports efficient material removal during lapping and polishing.
Balanced Surface Performance:
Combines useful removal efficiency with controlled surface finishing.
Cost-Performance Alternative:
Provides a practical option where full polycrystalline diamond is not required.

Specifications

Diamond Type	Specialty Synthetic Diamond Micron Powder
Product Series	Polycrystalline-Like Diamond Powder
Grade	PLLM
Grade Direction	Polycrystalline-Like / Cost-Performance Grade
Particle Morphology	Irregular multi-edge particles
Fracture Behavior	Controlled micro-fracturing / self-sharpening
Selection Focus	Removal efficiency, surface quality and cost control
Typical Processes	Lapping / Polishing / Surface Finishing

Model	D10 (µm)	D50 (µm)	D95 (µm)	Application
PLLM 1/8	≥0.06	0.10–0.14	≤0.21	End surface polishing of optical crystal, ultra-hard ceramic, wafer substrate, and metal.
PLLM 1/4	≥0.11	0.20–0.25	≤0.40
PLLM 0-1	≥0.40	0.48–0.55	≤0.72
PLLM 0-2	≥0.70	0.90–1.10	≤1.50
PLLM 2-4	≥1.80	2.70–3.00	≤4.50	Lapping, rough polishing, and back thinning of sapphire and wafer substrate.
PLLM 3-6	≥2.80	4.00–4.40	≤7.00
PLLM 4-8	≥4.00	5.50–6.00	≤8.60
PLLM 5-9	≥4.70	6.30–7.00	≤10.00
PLLM 5-12	≥5.20	7.20–7.80	≤13.00