- Monocrystalline Diamond Abrasive:Selected single-crystal particles provide consistent cutting characteristics.
- Efficient Material Removal: Sharp diamond edges support controlled lapping and polishing of hard materials.
- Controlled Particle Size: Selected micron grades support different polishing stages and surface finish requirements.
- Consistent Abrasive Distribution: Uniformly formulated paste supports stable polishing performance.
- Water- and Oil-Based Options: Carrier formulations can be selected according to the workpiece, lubrication and cleaning requirements.
Monocrystalline Diamond Paste
Features
Specifications
| Product Type | Diamond Polishing Paste |
|---|---|
| Abrasive Type | Monocrystalline Synthetic Diamond |
| Particle Size | Selected micron grades from 0.5–40 µm |
| Particle Size Distribution | Controlled according to selected grade |
| Base Medium | Water-Based / Oil-Based |
| Concentration Options |
Light: 10–20% Medium: 30–50% Heavy: 60–90% |
| Custom Formulation | Diamond concentration and carrier type can be adjusted according to customer requirements. |
| Product Form | Ready-to-Use Polishing Paste |
| Selection Focus | Particle size, diamond concentration, carrier type and polishing requirements |
-
Base Medium:
- Oil-Based Diamond Paste: Provides good lubrication and extended working time. Suitable for polishing metals, cemented carbides, molds, and precision components.
- Water-Based Diamond Paste: Offers easy cleaning and minimal oily residue. Suitable for polishing glass, ceramics, and precision components requiring clean processing.
Diamond Polishing Paste Particle Size Chart
|
Particle Size (μm) |
Reference Mesh / Grit No. (#) |
Reference W Grade |
Reference D50 (μm) |
Suggested Polishing Stage |
|---|---|---|---|---|
| 30–40 | 450# | W40 | 29–32* | Coarse Lapping |
| 20–30 | 700# | W28 | 20–30 | General Lapping & Polishing |
| 12–22 | 1000# | W20 | 15.0–17.0 | |
| 7–14 | 1300# | W14 | 9.1–10.5 | |
| 5–10 | 2000# | W10 | 6.5–7.3 | |
| 4–8 | 3000# | W7 | 5.0–6.0 | Fine Polishing |
| 3–6 | 4000# | W5 | 3.5–4.5 | |
| 2–4 | 6000# | W3.5 | 2.2–2.6 | |
| 1–3 | 10000# | W2.5 | 1.6–1.8 | Ultra-Fine / Mirror Polishing |
| 1–2 | 12000# | W1.5 | 1.1–1.3 | |
| 0–1 | 15000# | W1.0 | 0.6–0.8 | |
| 0–0.5 | 30000# | W0.5 | 0.2–0.3 |
Note: Grit numbers, W grades and D50 values are provided as reference specifications. Actual particle size distribution and recommended polishing stages may vary according to the selected grade, workpiece material and processing conditions.
Applications
Cemented Carbides
Used for precision polishing of hard carbide tools and components.
- Tungsten carbide tool polishing
- Carbide mold and die finishing
- Precision component lapping
Mold & Die
Used for controlled surface finishing of precision molds and dies.
- Mold steel polishing
- Carbide die cavity finishing
- Precision mold surface preparation
Ceramic Manufacturing
Suitable for lapping and polishing hard ceramic components.
- Technical ceramic polishing
- Ceramic component finishing
- Precision surface refinement
Optical & Optoelectronic
Used for precision finishing of optical and crystalline materials.
- Optical glass polishing
- Sapphire component finishing
- Precision optical surface preparation
Semiconductor
Used for precision lapping and pre-polishing of hard semiconductor substrates before final surface finishing.
- SiC wafer lapping and pre-polishing
- Hard semiconductor substrate surface preparation
- Controlled material removal before final CMP