Monocrystalline Diamond Paste
Monocrystalline Diamond Paste
Monocrystalline Diamond Paste
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Monocrystalline Diamond Paste

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
Monocrystalline Diamond Paste is a precision polishing compound formulated with selected single-crystal synthetic diamond abrasives for efficient and controlled material removal. Available in water- and oil-based formulations, it provides consistent cutting action across different polishing stages and is suitable for cemented carbides, molds, ceramics, glass and other precision components requiring controlled surface finish and dimensional accuracy.

Features

  • Monocrystalline Diamond Abrasive:Selected single-crystal particles provide consistent cutting characteristics.
  • Efficient Material Removal: Sharp diamond edges support controlled lapping and polishing of hard materials.
  • Controlled Particle Size: Selected micron grades support different polishing stages and surface finish requirements.
  • Consistent Abrasive Distribution: Uniformly formulated paste supports stable polishing performance.
  • Water- and Oil-Based Options: Carrier formulations can be selected according to the workpiece, lubrication and cleaning requirements.

Specifications


Product Type Diamond Polishing Paste
Abrasive Type Monocrystalline Synthetic Diamond
Particle Size Selected micron grades from 0.5–40 µm
Particle Size Distribution Controlled according to selected grade
Base Medium Water-Based / Oil-Based
Concentration Options Light: 10–20%
Medium: 30–50%
Heavy: 60–90%
Custom Formulation Diamond concentration and carrier type
can be adjusted according to customer
requirements.
Product Form Ready-to-Use Polishing Paste
Selection Focus Particle size, diamond concentration,
carrier type and polishing requirements
  • Base Medium:

    • Oil-Based Diamond Paste: Provides good lubrication and extended working time. Suitable for polishing metals, cemented carbides, molds, and precision components.
    • Water-Based Diamond Paste: Offers easy cleaning and minimal oily residue. Suitable for polishing glass, ceramics, and precision components requiring clean processing.

Diamond Polishing Paste Particle Size Chart

Particle Size
(μm)
Reference Mesh /
Grit No. (#)
Reference
W Grade
Reference D50
(μm)
Suggested
Polishing Stage
30–40 450# W40 29–32* Coarse Lapping
20–30 700# W28 20–30 General Lapping & Polishing
12–22 1000# W20 15.0–17.0
7–14 1300# W14 9.1–10.5
5–10 2000# W10 6.5–7.3
4–8 3000# W7 5.0–6.0 Fine Polishing
3–6 4000# W5 3.5–4.5
2–4 6000# W3.5 2.2–2.6
1–3 10000# W2.5 1.6–1.8 Ultra-Fine / Mirror Polishing
1–2 12000# W1.5 1.1–1.3
0–1 15000# W1.0 0.6–0.8
0–0.5 30000# W0.5 0.2–0.3

Note: Grit numbers, W grades and D50 values are provided as reference specifications. Actual particle size distribution and recommended polishing stages may vary according to the selected grade, workpiece material and processing conditions.

Applications

Cemented Carbides

Used for precision polishing of hard carbide tools and components.

  • Tungsten carbide tool polishing
  • Carbide mold and die finishing
  • Precision component lapping
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Mold & Die

Used for controlled surface finishing of precision molds and dies.

  • Mold steel polishing
  • Carbide die cavity finishing
  • Precision mold surface preparation
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Ceramic Manufacturing

Suitable for lapping and polishing hard ceramic components.

  • Technical ceramic polishing
  • Ceramic component finishing
  • Precision surface refinement
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Optical & Optoelectronic

Used for precision finishing of optical and crystalline materials.

  • Optical glass polishing
  • Sapphire component finishing
  • Precision optical surface preparation
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Semiconductor

Used for precision lapping and pre-polishing of hard semiconductor substrates before final surface finishing.

  • SiC wafer lapping and pre-polishing
  • Hard semiconductor substrate surface preparation
  • Controlled material removal before final CMP
Semiconductor

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