- Ultra-Fine Diamond Abrasives: Available in nominal sizes from 30–500 nm for fine surface refinement.
- Selectable Diamond Types: HPHT-derived or detonation nanodiamond can be selected according to application requirements.
- Dispersion Control: Formulation and processing help manage particle distribution and agglomeration.
- Fine Material Removal: Supports controlled polishing of selected hard and brittle substrates.
- Customizable Formulation: Carrier system, diamond concentration and viscosity can be adjusted as required.
Nano Diamond Slurry
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
Nano Diamond Slurry (NDS) is a liquid polishing formulation containing selected nano and submicron diamond abrasives for ultra-fine surface finishing of hard materials. Available in nominal sizes from 30–500 nm, it can be formulated with HPHT-derived or detonation nanodiamond according to the application. Particle sizing, dispersion and carrier selection can be matched to precision polishing requirements for SiC, sapphire, optical crystals and other hard substrates.
Features
Specifications
| Product Type | Nano Diamond Slurry |
|---|---|
| Product Series | NDS |
| Abrasive Type | HPHT-Derived Nanodiamond (HND) / Detonation Nanodiamond (DND) |
| Nominal Particle Size | 30–500 nm, depending on the selected grade |
| Particle Size Specification | Primary particle size and dispersion / aggregate size specified as applicable |
| Carrier System | Water-Based / Oil-Based, subject to formulation |
| Diamond Concentration | Customizable; specified in ct/L or wt% according to the supplied formulation |
| Viscosity and pH | Specified according to the selected formulation and process requirements |
| Typical Appearance | Dark Gray; may vary with formulation |
| Packaging | 500 mL / 1 L / 5 L / 25 L; custom volumes available upon request |
Applications
Semiconductor
Used for ultra-fine mechanical polishing of selected hard semiconductor substrates requiring fine surface refinement.
- SiC wafer and substrate fine polishing
- Precision polishing of hard semiconductor samples
- Ultra-fine crystalline surface finishing
Optical & Optoelectronic
Used for fine polishing of sapphire and selected hard optical materials.
- Sapphire substrate finishing
- Optical crystal ultra-fine polishing
- Precision optoelectronic component finishing
Metallographic Sample Preparation
Used for fine polishing of selected hard material specimens requiring controlled abrasive action.
- Hard alloy specimen polishing
- Prepared cross-section finishing
- Precision surface preparation for microscopy