Nano Diamond Slurry
Nano Diamond Slurry
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Nano Diamond Slurry

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
Nano Diamond Slurry (NDS) is a liquid polishing formulation containing selected nano and submicron diamond abrasives for ultra-fine surface finishing of hard materials. Available in nominal sizes from 30–500 nm, it can be formulated with HPHT-derived or detonation nanodiamond according to the application. Particle sizing, dispersion and carrier selection can be matched to precision polishing requirements for SiC, sapphire, optical crystals and other hard substrates.

Features

  • Ultra-Fine Diamond Abrasives: Available in nominal sizes from 30–500 nm for fine surface refinement.
  • Selectable Diamond Types: HPHT-derived or detonation nanodiamond can be selected according to application requirements.
  • Dispersion Control: Formulation and processing help manage particle distribution and agglomeration.
  • Fine Material Removal: Supports controlled polishing of selected hard and brittle substrates.
  • Customizable Formulation: Carrier system, diamond concentration and viscosity can be adjusted as required.

Specifications

Product Type Nano Diamond Slurry
Product Series NDS
Abrasive Type HPHT-Derived Nanodiamond (HND) / Detonation Nanodiamond (DND)
Nominal Particle Size 30–500 nm, depending on the selected grade
Particle Size Specification Primary particle size and dispersion / aggregate size specified as applicable
Carrier System Water-Based / Oil-Based, subject to formulation
Diamond Concentration Customizable; specified in ct/L or wt% according to the supplied formulation
Viscosity and pH Specified according to the selected formulation and process requirements
Typical Appearance Dark Gray; may vary with formulation
Packaging 500 mL / 1 L / 5 L / 25 L; custom volumes available upon request

Applications

Semiconductor

Used for ultra-fine mechanical polishing of selected hard semiconductor substrates requiring fine surface refinement.

  • SiC wafer and substrate fine polishing
  • Precision polishing of hard semiconductor samples
  • Ultra-fine crystalline surface finishing
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Optical & Optoelectronic

Used for fine polishing of sapphire and selected hard optical materials.

  • Sapphire substrate finishing
  • Optical crystal ultra-fine polishing
  • Precision optoelectronic component finishing
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Metallographic Sample Preparation

Used for fine polishing of selected hard material specimens requiring controlled abrasive action.

  • Hard alloy specimen polishing
  • Prepared cross-section finishing
  • Precision surface preparation for microscopy
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