Monocrystalline Diamond Slurry

Monocrystalline Diamond Slurry

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
Monocrystalline Diamond Slurry (MDS) is a liquid polishing formulation containing selected single-crystal diamond abrasives for precision lapping and polishing. Its defined cutting edges support controlled material removal from hard and brittle materials, while water- and oil-based carrier options allow the slurry to be matched to different workpieces and polishing equipment. MDS is suitable for cemented carbides, advanced ceramics, sapphire and selected hard semiconductor substrates.

Features

  • Monocrystalline Diamond Abrasive: Single-crystal diamond particles provide defined cutting edges for precision lapping and polishing.
  • Controlled Particle Sizes: Selected micron and submicron grades support different material removal and finishing requirements.
  • Consistent Abrasive Delivery: The liquid formulation supports uniform abrasive distribution during controlled slurry feeding.
  • Water- and Oil-Based Options: Carrier formulations can be selected according to lubrication, cleaning and process requirements.
  • Customizable Formulation: Diamond concentration and viscosity can be adjusted for different polishing conditions.

Specifications

Product Type Monocrystalline Diamond Slurry
Product Series MDS
Abrasive Type Monocrystalline Synthetic Diamond
Nominal Particle Size 0.1–40μm;
Particle Size Distribution Controlled according to the selected grade; PSD data available upon request
Carrier System Water-Based / Oil-Based
Diamond Concentration Customizable; specified in ct/L or wt% according to the supplied formulation
Viscosity Adjustable according to equipment and dispensing requirements
Packaging 500 mL / 1 L / 5 L / 25 L; custom volumes available upon request
Product Form Liquid Diamond Polishing Slurry
Nominal Size Water-Based Model Oil-Based Model
6 μm MDS-6U-W MDS-6U-O
4 μm MDS-4U-W MDS-4U-O
3 μm MDS-3U-W MDS-3U-O
2 μm MDS-2U-W MDS-2U-O
1 μm MDS-1U-W MDS-1U-O
0.5 μm MDS-500N-W MDS-500N-O
0.25 μm MDS-250N-W MDS-250N-O
0.2 μm MDS-200N-W MDS-200N-O
0.1 μm MDS-100N-W MDS-100N-O

Applications

Cemented Carbides

Used for precision lapping and polishing of carbide tools and wear-resistant components..

  • Tungsten carbide tool polishing
  • Carbide die and component finishing
  • Precision carbide surface refinement
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Optical & Optoelectronic

Used for controlled polishing of hard optical and crystalline materials.

  • Sapphire substrate polishing
  • Optical crystal surface finishing
  • Precision optical component preparation
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Semiconductor

Used for precision lapping and mechanical polishing of selected hard semiconductor substrates.

  • SiC wafer and substrate polishing
  • Hard semiconductor sample preparation
  • Controlled surface refinement of crystalline substrates
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