- Monocrystalline Diamond Abrasive: Single-crystal diamond particles provide defined cutting edges for precision lapping and polishing.
- Controlled Particle Sizes: Selected micron and submicron grades support different material removal and finishing requirements.
- Consistent Abrasive Delivery: The liquid formulation supports uniform abrasive distribution during controlled slurry feeding.
- Water- and Oil-Based Options: Carrier formulations can be selected according to lubrication, cleaning and process requirements.
- Customizable Formulation: Diamond concentration and viscosity can be adjusted for different polishing conditions.
Monocrystalline Diamond Slurry
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
Monocrystalline Diamond Slurry (MDS) is a liquid polishing formulation containing selected single-crystal diamond abrasives for precision lapping and polishing. Its defined cutting edges support controlled material removal from hard and brittle materials, while water- and oil-based carrier options allow the slurry to be matched to different workpieces and polishing equipment. MDS is suitable for cemented carbides, advanced ceramics, sapphire and selected hard semiconductor substrates.
Features
Specifications
| Product Type | Monocrystalline Diamond Slurry |
|---|---|
| Product Series | MDS |
| Abrasive Type | Monocrystalline Synthetic Diamond |
| Nominal Particle Size | 0.1–40μm; |
| Particle Size Distribution | Controlled according to the selected grade; PSD data available upon request |
| Carrier System | Water-Based / Oil-Based |
| Diamond Concentration | Customizable; specified in ct/L or wt% according to the supplied formulation |
| Viscosity | Adjustable according to equipment and dispensing requirements |
| Packaging | 500 mL / 1 L / 5 L / 25 L; custom volumes available upon request |
| Product Form | Liquid Diamond Polishing Slurry |
| Nominal Size | Water-Based Model | Oil-Based Model |
|---|---|---|
| 6 μm | MDS-6U-W | MDS-6U-O |
| 4 μm | MDS-4U-W | MDS-4U-O |
| 3 μm | MDS-3U-W | MDS-3U-O |
| 2 μm | MDS-2U-W | MDS-2U-O |
| 1 μm | MDS-1U-W | MDS-1U-O |
| 0.5 μm | MDS-500N-W | MDS-500N-O |
| 0.25 μm | MDS-250N-W | MDS-250N-O |
| 0.2 μm | MDS-200N-W | MDS-200N-O |
| 0.1 μm | MDS-100N-W | MDS-100N-O |
Applications
Cemented Carbides
Used for precision lapping and polishing of carbide tools and wear-resistant components..
- Tungsten carbide tool polishing
- Carbide die and component finishing
- Precision carbide surface refinement
Optical & Optoelectronic
Used for controlled polishing of hard optical and crystalline materials.
- Sapphire substrate polishing
- Optical crystal surface finishing
- Precision optical component preparation
Semiconductor
Used for precision lapping and mechanical polishing of selected hard semiconductor substrates.
- SiC wafer and substrate polishing
- Hard semiconductor sample preparation
- Controlled surface refinement of crystalline substrates