- Engineered Diamond Agglomerates: Fine diamond particles form near-spherical abrasive clusters with multiple cutting points.
- Defined Primary and Aggregate Sizes: Original diamond size and finished agglomerate size can be selected separately.
- Controlled Abrasive Action: Aggregate structure and wear behaviour support precision lapping and polishing.
- Hard Substrate Processing: Designed for selected sapphire, SiC and advanced ceramic applications.
- Customizable Slurry Formulation: Diamond concentration and carrier properties can be matched to processing requirements.
Agglomerated Diamond Slurry
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
Agglomerated Diamond Slurry (ADS) is a precision lapping and polishing formulation containing engineered, near-spherical diamond agglomerates made from fine diamond particles. Its structured abrasive clusters provide multiple cutting points and can undergo controlled wear during processing, supporting consistent abrasive action on selected hard and brittle materials. ADS is designed for applications such as sapphire, SiC and precision ceramics, where both material removal and surface quality require careful process control.
Features
Specifications
| Product Type | Agglomerated Diamond Slurry |
|---|---|
| Product Series | ADS |
| Abrasive Structure | Near-Spherical Diamond Agglomerates |
| Primary Diamond Size | 0.5 μm / 1.5 μm in the listed grades |
| Aggregate Particle Size | Selected grades from 20–50 μm |
| Typical Appearance | Light Gray Liquid |
| pH | 5–8 (reference; confirm by formulation) |
| Viscosity | Grade-dependent; confirm the applicable specification at its test temperature |
| Diamond Concentration | Specified according to the selected formulation; custom options upon request |
| Packaging | Custom volume available upon request |
| Specification | Particle Size | Appearance | pH | Viscosity | Model |
|---|---|---|---|---|---|
| 0.5 µm | 20 µm | Light grey liquid | 5–8 | >20 cp | ADS-P10-Z0.5-20 |
| 25 µm | >20 cp | ADS-P10-Z0.5-25 | |||
| 30 µm | >30 cp | ADS-P10-Z0.5-30 | |||
| 1.5 µm | 30 µm | >20 cp | ADS-P10-Z1.5-30 | ||
| 35 µm | >20 cp | ADS-P10-Z1.5-35 | |||
| 40 µm | >30 cp | ADS-P10-Z1.5-40 | |||
| 45–50 µm | >30 cp | ADS-P10-Z1.5-50 |
Applications
Semiconductor
Used for controlled mechanical lapping and polishing of selected hard semiconductor substrates.
- SiC wafer and substrate polishing
- Hard crystalline substrate surface processing
- Precision removal of previous machining marks
Optical & Optoelectronic
Used for precision lapping and polishing of sapphire and selected hard optical crystals.
- Sapphire wafer and window processing
- Hard optical crystal surface finishing
- Precision crystalline component polishing
Ceramic Manufacturing
Used for controlled lapping and polishing of selected advanced ceramic components.
- Silicon nitride ceramic ball finishing
- Precision zirconia component polishing
- Hard ceramic surface refinement