Agglomerated Diamond Slurry

Agglomerated Diamond Slurry

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
Agglomerated Diamond Slurry (ADS) is a precision lapping and polishing formulation containing engineered, near-spherical diamond agglomerates made from fine diamond particles. Its structured abrasive clusters provide multiple cutting points and can undergo controlled wear during processing, supporting consistent abrasive action on selected hard and brittle materials. ADS is designed for applications such as sapphire, SiC and precision ceramics, where both material removal and surface quality require careful process control.

Features

  • Engineered Diamond Agglomerates: Fine diamond particles form near-spherical abrasive clusters with multiple cutting points.
  • Defined Primary and Aggregate Sizes: Original diamond size and finished agglomerate size can be selected separately.
  • Controlled Abrasive Action: Aggregate structure and wear behaviour support precision lapping and polishing.
  • Hard Substrate Processing: Designed for selected sapphire, SiC and advanced ceramic applications.
  • Customizable Slurry Formulation: Diamond concentration and carrier properties can be matched to processing requirements.

Specifications

Product Type Agglomerated Diamond Slurry
Product Series ADS
Abrasive Structure Near-Spherical Diamond Agglomerates
Primary Diamond Size 0.5 μm / 1.5 μm in the listed grades
Aggregate Particle Size Selected grades from 20–50 μm
Typical Appearance Light Gray Liquid
pH 5–8 (reference; confirm by formulation)
Viscosity Grade-dependent; confirm the applicable
specification at its test temperature
Diamond Concentration Specified according to the selected
formulation; custom options upon request
Packaging Custom volume available upon request

Specification Particle Size Appearance pH Viscosity Model
0.5 µm 20 µm Light grey liquid 5–8 >20 cp ADS-P10-Z0.5-20
25 µm >20 cp ADS-P10-Z0.5-25
30 µm >30 cp ADS-P10-Z0.5-30
1.5 µm 30 µm >20 cp ADS-P10-Z1.5-30
35 µm >20 cp ADS-P10-Z1.5-35
40 µm >30 cp ADS-P10-Z1.5-40
45–50 µm >30 cp ADS-P10-Z1.5-50

Applications

Semiconductor

Used for controlled mechanical lapping and polishing of selected hard semiconductor substrates.

  • SiC wafer and substrate polishing
  • Hard crystalline substrate surface processing
  • Precision removal of previous machining marks
Read More

Optical & Optoelectronic

Used for precision lapping and polishing of sapphire and selected hard optical crystals.

  • Sapphire wafer and window processing
  • Hard optical crystal surface finishing
  • Precision crystalline component polishing
Read More

Ceramic Manufacturing

Used for controlled lapping and polishing of selected advanced ceramic components.

  • Silicon nitride ceramic ball finishing
  • Precision zirconia component polishing
  • Hard ceramic surface refinement
Read More

Inquiry Now

Submitting...

We normally respond within 24 hours.

Chat with us on WhatsApp