AMD-Agglomerated Diamond Powder

AMD-Agglomerated Diamond Powder

20+ Years Experience Consistent Batch Quality Customized Solutions
Product Overview
AMD is an agglomerated diamond powder formed by controlled aggregation of selected fine diamond particles into larger, rounded granules. Developed for lapping and polishing processes requiring efficient material removal with controlled surface quality, the multi-particle aggregate structure provides numerous cutting points and progressive abrasive renewal as the agglomerates wear. Aggregate size and strength can be adjusted to suit different slurry, pad and precision finishing requirements.

Features

  • Agglomerated Multi-Particle Structure: Fine diamond particles are combined into larger granules with multiple active cutting points.
  • Rounded Aggregate Morphology: Supports more uniform abrasive contact and controlled surface interaction.
  • Progressive Abrasive Renewal: Controlled aggregate breakdown exposes fresh diamond particles during processing.
  • High Removal Efficiency: Multiple cutting points support efficient lapping and polishing.
  • Customizable Aggregate Size and Strength: Aggregate characteristics can be adjusted for specific slurry and finishing processes.

Specifications

Diamond Type Agglomerated Synthetic Diamond
Product Series Specialty Diamond Powder
Grade AMD
Structure Aggregate of selected fine diamond particles
Aggregate Morphology Rounded to near-spherical granules
Wear Behavior Progressive aggregate breakdown and abrasive renewal
Selection Focus Removal efficiency, aggregate control and surface consistency
Typical Processes Lapping / Polishing / Precision Surface Finishing
Item Original Size (µm) Finished Size (µm) Product Mark
AMD
(Agglomerated Diamond Powder)
0.5 10 AMD0510
1.5 22 AMD1522
1.5 32 AMD1532
1.5 46 AMD1546
3.0 35 AMD3035
4.0 45 AMD4045
7.0 75 AMD7075
7.0 125 AMD70125

Applications

Semiconductor Material Lapping & Polishing

Suitable for controlled lapping and polishing with high removal efficiency.

  • Sapphire substrate lapping
  • SiC surface preparation
  • Wafer thinning and pre-polishing
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Optics, Glass & Sapphire Polishing

Suitable for uniform polishing with controlled abrasive contact and removal.

  • Optical glass polishing
  • Sapphire surface finishing
  • Precision crystal lapping and polishing
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Advanced Ceramic Lapping & Polishing

Suitable for efficient polishing of hard ceramics with controlled surface quality.

  • Alumina and zirconia lapping
  • Technical ceramic polishin
  • Glass-ceramic surface finishing
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