- Agglomerated Multi-Particle Structure: Fine diamond particles are combined into larger granules with multiple active cutting points.
- Rounded Aggregate Morphology: Supports more uniform abrasive contact and controlled surface interaction.
- Progressive Abrasive Renewal: Controlled aggregate breakdown exposes fresh diamond particles during processing.
- High Removal Efficiency: Multiple cutting points support efficient lapping and polishing.
- Customizable Aggregate Size and Strength: Aggregate characteristics can be adjusted for specific slurry and finishing processes.
AMD-Agglomerated Diamond Powder
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
AMD is an agglomerated diamond powder formed by controlled aggregation of selected fine diamond particles into larger, rounded granules. Developed for lapping and polishing processes requiring efficient material removal with controlled surface quality, the multi-particle aggregate structure provides numerous cutting points and progressive abrasive renewal as the agglomerates wear. Aggregate size and strength can be adjusted to suit different slurry, pad and precision finishing requirements.
Features
Specifications
| Diamond Type | Agglomerated Synthetic Diamond |
|---|---|
| Product Series | Specialty Diamond Powder |
| Grade | AMD |
| Structure | Aggregate of selected fine diamond particles |
| Aggregate Morphology | Rounded to near-spherical granules |
| Wear Behavior | Progressive aggregate breakdown and abrasive renewal |
| Selection Focus | Removal efficiency, aggregate control and surface consistency |
| Typical Processes | Lapping / Polishing / Precision Surface Finishing |
| Item | Original Size (µm) | Finished Size (µm) | Product Mark |
|---|---|---|---|
| AMD (Agglomerated Diamond Powder) |
0.5 | 10 | AMD0510 |
| 1.5 | 22 | AMD1522 | |
| 1.5 | 32 | AMD1532 | |
| 1.5 | 46 | AMD1546 | |
| 3.0 | 35 | AMD3035 | |
| 4.0 | 45 | AMD4045 | |
| 7.0 | 75 | AMD7075 | |
| 7.0 | 125 | AMD70125 |
Applications
Semiconductor Material Lapping & Polishing
Suitable for controlled lapping and polishing with high removal efficiency.
- Sapphire substrate lapping
- SiC surface preparation
- Wafer thinning and pre-polishing
Optics, Glass & Sapphire Polishing
Suitable for uniform polishing with controlled abrasive contact and removal.
- Optical glass polishing
- Sapphire surface finishing
- Precision crystal lapping and polishing
Advanced Ceramic Lapping & Polishing
Suitable for efficient polishing of hard ceramics with controlled surface quality.
- Alumina and zirconia lapping
- Technical ceramic polishin
- Glass-ceramic surface finishing