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Controlled Porous Internal Structure:
Modifies particle fracture behavior compared with conventional dense micron diamond. -
Enhanced Self-Sharpening:
Progressive micro-fracturing exposes fresh cutting edges during processing. -
Controlled Friability:
Balances abrasive renewal with useful particle stability. -
Efficient Material Removal:
Self-renewing cutting edges help maintain active abrasive performance. -
Balanced Removal and Surface Quality:
Suitable for precision processes where cutting efficiency and finish must be controlled together.
IFDM – Internally Foamed Micron Diamond Powder
20+ Years Experience
Consistent Batch Quality
Customized Solutions
Product Overview
IFDM is an internally foamed micron diamond powder developed for precision lapping and polishing applications requiring controlled self-sharpening, efficient material removal and stable surface quality. Its engineered porous internal structure modifies the fracture behavior of conventional dense monocrystalline diamond, allowing progressive micro-fracturing to expose fresh cutting edges during use. This controlled abrasive renewal makes IFDM suitable for hard and brittle materials where removal efficiency and surface finish must be balanced.
Features
Specifications
| Diamond Type | Internally Modified Synthetic Diamond |
|---|---|
| Product Series | Specialty Micron Diamond Powder |
| Grade | IFDM |
| Grade Direction | Internally Foamed / Porous Structure Grade |
| Internal Structure | Controlled porous internal structure |
| Fracture Behavior | Progressive micro-fracturing / self-sharpening |
| Selection Focus | Abrasive renewal, removal efficiency and surface control |
| Typical Processes | Precision Lapping / Polishing / Selected Fine Abrasive Applications |
| Product Series | Available Particle Size Range |
|---|---|
| SRDM | Available particle sizes: ≥ 1 µm |
| IFDM | Available particle sizes: ≥ 7 µm |
Applications
Semiconductor Material Lapping & Polishing
Suitable for controlled lapping and polishing of hard semiconductor-related materials.
- Sapphire substrate lapping
- SiC surface preparation
- Wafer back thinning and pre-polishing
Optics, Glass & Sapphire Processing
Suitable for controlled material removal where surface quality is important.
- Sapphire lapping and pre-polishing
- Optical glass surface finishing
- Quartz and crystal polishing
Advanced Ceramic Lapping & Polishing
Suitable for efficient finishing of hard ceramics requiring controlled abrasive renewal.
- Alumina and zirconia lapping
- Technical ceramic polishing
- Precision ceramic surface finishing