W Coated Diamond Powder

20+ Years Experience Consistent Batch Quality Customized Solutions

Product Overview

W Coated Diamond Powder is a tungsten-coated synthetic diamond developed primarily for copper–diamond and other high-performance thermal composites requiring controlled interface engineering. During suitable thermal processing, the tungsten layer can react with diamond to form tungsten carbide phases at the interface, improving diamond–matrix bonding and supporting efficient thermal transfer in heat-spreading and electronic packaging materials.

Features

Tungsten Surface Coating: Provides a controlled refractory-metal layer on the diamond surface.
Carbide-Forming Interface: Tungsten can form W₂C and WC phases during suitable thermal processing.
Improved Diamond–Copper Interface: Supports stronger interfacial bonding in copper-matrix thermal composites.
Thermal Interface Control: A controlled W / tungsten-carbide layer can reduce unfavorable direct diamond–copper contact.
High-Temperature Stability: Tungsten provides a refractory interface suitable for demanding composite manufacturing conditions.
Controlled Coating Design: Coating integrity and thickness can be matched to particle size and composite processing requirements.

Specifications

Material Type	Tungsten-Coated Synthetic Diamond
Coating Material	Tungsten (W)
Base Diamond	Selected Monocrystalline Thermal-Grade Diamond
Coating State	Metallic W / Carbide-Forming Interface
Available Particle Size	Micron and Mesh / Grit Grades
Coating Thickness	Controlled according to particle size and matrix requirements
Interfacial Reaction	May form W₂C / WC during subsequent thermal processing
Primary Function	Interface Bonding / Reaction Control / Thermal Transfer
Typical Matrix Systems	Primarily Copper-Matrix Thermal Composites
Selection Focus	Coating integrity, thickness, diamond size and processing temperature