- Pre-Formed TiC Interface: Provides a controlled carbide layer directly on the diamond surface.
- Improved Metal-Matrix Bonding: Enhances interfacial compatibility with selected copper, aluminium and metal-matrix systems.
- Controlled Interfacial Reaction: Reduces dependence on complete in-situ Ti-to-TiC conversion during final composite processing.
- Thermal Interface Engineering: A thin and controlled TiC layer can support efficient heat transfer across the diamond–matrix interface.
- Diamond Surface Protection: Helps separate the diamond core from direct contact with reactive matrix components.
- Controlled Coating Thickness: Coating specification can be matched to particle size, matrix chemistry and processing conditions.
TiC Coated Diamond Powder
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Product Overview
TiC Coated Diamond Powder is an interface-engineered diamond grade with a controlled titanium carbide layer formed on the diamond surface. Compared with metallic Ti coating, the pre-formed TiC interface provides a defined carbide layer before final composite processing, making it particularly suitable for copper–diamond, aluminium–diamond and other thermal composites requiring controlled interfacial bonding and thermal transport.
Features
Specifications
| Material Type | TiC-Coated Synthetic Diamond |
|---|---|
| Coating Material | Titanium Carbide (TiC) |
| Base Diamond | Selected Monocrystalline Thermal-Grade Diamond |
| Typical Appearance | Dark Gray to Black |
| Coating State | Pre-Formed Carbide Interface |
| Typical Coating Route | Vacuum Ti deposition followed by controlled reaction heat treatment to form TiC |
| Available Particle Size | Micron and Mesh / Grit Grades |
| Coating Thickness | Controlled according to particle size and matrix requirements |
| Typical Matrix Systems | Copper / Aluminium / Other Metal-Matrix Composites |
| Selection Focus | TiC thickness, coverage, particle size and composite processing method |
Applications
Thermal Management
Used in interface-engineered thermal composites requiring controlled diamond–matrix bonding.
- Heat spreaders
- High-conductivity thermal composites
- Power electronic cooling materials
Diamond Composites
Designed for metal-matrix systems where carbide interface control is important.
- Copper–diamond composites
- Aluminium–diamond composites
- Metal-matrix thermal materials
Semiconductor
Used in thermal composite materials for high-power semiconductor packaging.
- Electronic packaging heat spreaders
- Power-device thermal substrates
- High-density device cooling