TiC Coated Diamond Powder

TiC Coated Diamond Powder

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Product Overview
TiC Coated Diamond Powder is an interface-engineered diamond grade with a controlled titanium carbide layer formed on the diamond surface. Compared with metallic Ti coating, the pre-formed TiC interface provides a defined carbide layer before final composite processing, making it particularly suitable for copper–diamond, aluminium–diamond and other thermal composites requiring controlled interfacial bonding and thermal transport.

Features

  • Pre-Formed TiC Interface: Provides a controlled carbide layer directly on the diamond surface.
  • Improved Metal-Matrix Bonding: Enhances interfacial compatibility with selected copper, aluminium and metal-matrix systems.
  • Controlled Interfacial Reaction: Reduces dependence on complete in-situ Ti-to-TiC conversion during final composite processing.
  • Thermal Interface Engineering: A thin and controlled TiC layer can support efficient heat transfer across the diamond–matrix interface.
  • Diamond Surface Protection: Helps separate the diamond core from direct contact with reactive matrix components.
  • Controlled Coating Thickness: Coating specification can be matched to particle size, matrix chemistry and processing conditions.

Specifications

Material Type TiC-Coated Synthetic Diamond
Coating Material Titanium Carbide (TiC)
Base Diamond Selected Monocrystalline Thermal-Grade Diamond
Typical Appearance Dark Gray to Black
Coating State Pre-Formed Carbide Interface
Typical Coating Route Vacuum Ti deposition followed by controlled reaction heat treatment to form TiC
Available Particle Size Micron and Mesh / Grit Grades
Coating Thickness Controlled according to particle size and matrix requirements
Typical Matrix Systems Copper / Aluminium / Other Metal-Matrix Composites
Selection Focus TiC thickness, coverage, particle size and composite processing method

Applications

Thermal Management

Used in interface-engineered thermal composites requiring controlled diamond–matrix bonding.

  • Heat spreaders
  • High-conductivity thermal composites
  • Power electronic cooling materials
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Diamond Composites

Designed for metal-matrix systems where carbide interface control is important.

  • Copper–diamond composites
  • Aluminium–diamond composites
  • Metal-matrix thermal materials
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Semiconductor

Used in thermal composite materials for high-power semiconductor packaging.

  • Electronic packaging heat spreaders
  • Power-device thermal substrates
  • High-density device cooling
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