WSD – Diamond Powder for Wire Saw

20+ Years Experience Consistent Batch Quality Customized Solutions

Product Overview

WSD is an application-specific monocrystalline diamond powder developed for fixed-abrasive diamond wire used in precision slicing of hard and brittle materials. Selected high-strength diamond particles, controlled blocky morphology and concentrated particle size distribution support consistent abrasive exposure, cutting efficiency and kerf quality in wire-saw applications.

Features

High-Strength Diamond Feedstock: Provides stable particle integrity under continuous slicing conditions.
Controlled Blocky Morphology: Supports consistent abrasive exposure on fixed diamond wire.
Concentrated Particle Size Distribution: Helps maintain uniform cutting behavior and kerf consistency.
Controlled Oversize: Supports stable wire coating and predictable cutting performance.
Low Flake and Elongated Particle Content: Increases the proportion of effective abrasive grains.

Specifications

Diamond Type	HPHT Monocrystalline Diamond
Product Series	Application-Specific Micron Diamond Powder
Grade	WSD
Grade Direction	Fixed Diamond Wire Saw Grade
Relative Crystal Strength	High
Particle Morphology	Controlled blocky monocrystalline particles
Selection Focus	Particle integrity, abrasive exposure and cutting consistency
Typical Process	Fixed-Abrasive Wire Slicing

Available Grit Size Table (Special Series)
Item	1	2	3	4	5	6	7	8	9	10	11	12	13	14	15	16
PCDM	1–2	0.5–3	1–3	1.5–3	2–3	2–4	2–5	3–6	3–7	4–8	4–9	5–10	5–12	6–12	8–12	8–16
PCDM	8–20	10–20	12–22	12–25	15–25	16–26	20–30	22–36	20–40	30–40	25–45	30–50	40–50	36–54	40–60
WSD	4–8	5–10	6–12	8–12	8–16	10–20	20–30	30–40	35–45	40–50