HOW TO PROCESS

Application Process

In the semiconductor industry, Crownkyn provides diamond-based superhard material solutions for wafer slicing, thinning, polishing, and advanced packaging. Product selection and grit sizing are precisely matched to material type, wafer thickness, and surface integrity targets to support ultra-high precision manufacturing and stable mass production.

Cutting and Wafer Dicing

Cutting and dicing of semiconductor materials require superhard abrasives with extreme sharpness, strong grit retention, and effective heat control to minimize chipping and subsurface damage. Monocrystalline Diamond Powder and Coated Diamond Powder are core materials for dicing blades and slicing tools.

Ingot slicing and wafer dicing: 40/50 to 60/80 mesh for efficient separation and controlled fracture behavior
General wafer cutting: 80/100 to 100/120 mesh for balanced cutting speed and kerf accuracy
Ultra-thin or fragile wafers : Metal-coated (Ti/Ni) diamond grades to drastically improve grit retention and heat dissipation, ensuring blade stability, reducing chipping, and minimizing trailing defects

Typical applications: Silicon wafers, sapphire substrates, SiC wafers, GaAs and compound semiconductor materials.

Precision Grinding and Shaping

Precision grinding and shaping processes mainly use Monocrystalline Diamond Powder for stable, long-life grinding and Crushed Diamond Powder for aggressive stock removal during wafer thinning and edge profiling. This staged selection balances efficiency with dimensional control.

Back grinding: 80/100 to 120/140 mesh using crushed diamond for high removal efficiency
Fine grinding: 140/170 to 200/230 mesh using monocrystalline diamond for thickness control
Edge profiling: Monocrystalline diamond grades for stable edge geometry and reduced micro-cracks

Typical applications: Wafer thinning, wafer edge rounding, substrate shaping.

Lapping and Polishing

Lapping and polishing processes in semiconductor manufacturing use precisely graded Micron Diamond Powder, Diamond Slurry, and Diamond Paste in multi-step sequences to remove damage layers and achieve nanometer-level surface quality.

Pre-lapping: 15–30 μm for flatness correction and damage layer removal
Fine lapping: 6–14 μm to reduce grinding marks
Final polishing: 1–3 μm or finer for high-precision wafer surfaces

Typical applications: Silicon wafers, sapphire wafers, ceramic carriers, device substrates.

Ultra-Fine Finishing and Surface Engineering

For the highest-performance semiconductor applications, Nano Diamond Powder is critical for plastic-domain material removal, enabling ultra-smooth surfaces with minimal subsurface damage. Micron Diamond Powder supports preceding fine-finishing steps, while functional diamond materials address thermal challenges.

Ultra-fine finishing: ≤1 μm and nano-scale grades for ultra-smooth, low-defect surfaces
Surface conditioning: Diamond micro-powder treatments for improved reliability
Thermal management: Thermal Conductive Diamond for heat dissipation in high-power devices and packages

Typical applications: Power semiconductor substrates, advanced packaging components, high-frequency and high-power devices.

Semiconductor Application Overview

Manufacturing Area	Key Materials	Crownkyn Product Solutions	Value to You
Wafer Processing	Silicon, sapphire, SiC	Monocrystalline diamond, coated diamond	Reduce edge chipping and improve wafer yield in slicing and dicing processes.
Wafer Thinning & Shaping	Silicon wafers, compound semiconductors	Monocrystalline diamond, crushed diamond	Achieve thickness control < 2 μm with stable, high-throughput back grinding.
Precision Polishing	Semiconductor substrates	Micron diamond slurry and paste	Achieve Ra < 1 nm and excellent flatness for lithography and bonding.
Thermal & Advanced Use	Power devices, advanced packages	Nano diamond, thermal conductive diamond	Enhance heat dissipation by 30–50% in high-power-density semiconductor systems.

Crownkyn supports semiconductor manufacturers with application-driven diamond materials, helping you achieve higher yields, lower defect densities, and reliable performance across advanced semiconductor fabrication and packaging processes.