- Micron and Nano-Scale Particle Size: Supports flexible formulation from fine thermal interface layers to bulk composites.
- Narrow Particle Size Distribution: Ensures uniform dispersion and consistent thermal performance.
- High Purity Diamond: Minimizes internal defects and maximizes intrinsic thermal conductivity.
- Excellent Thermal Conductivity: Significantly enhances heat dissipation efficiency.
- Good Particle Morphology: Improves packing behavior and compatibility with various matrices.
- Stable Dispersion Performance: Maintains uniform distribution in polymers, resins, greases, and composites.
WTCD – Micron Thermal Conductive Diamond
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
WTCD is a micron and nano-scale thermal conductive diamond powder developed for high-efficiency thermal management applications. Featuring high-purity diamond particles with minimal internal defects and narrow particle size distribution, WTCD delivers excellent thermal conductivity and uniform dispersion. It is designed as a functional filler to enhance heat transfer performance in thermal interface materials and thermally conductive composites used in electronics and semiconductor industries.
Features
Specifications
The particle size range is 50 nm–50 µm and can be customized according to customer requirements.
Applications
Thermal Management
Widely used in thermal interface and heat dissipation materials.
- Thermal greases, adhesives, and interface pads
- Heat transfer layers and coatings
- Electronic and power device cooling materials
Semiconductor
Applied in thermal solutions for semiconductor devices.
- Chip packaging thermal fillers
- Heat dissipation materials for power devices
- High-density electronic thermal management
Composite Materials
Used as a functional filler to enhance composite thermal conductivity.
- Thermally conductive polymers and resins
- Electronic encapsulation materials
- High-performance composite systems