- High-Strength Diamond Feedstock: Delivers excellent toughness and durability under continuous cutting loads.
- Blocky and Uniform Crystal Shape: Ensures stable cutting action and efficient force transmission.
- Concentrated Particle Size Distribution: Provides consistent cutting performance and uniform kerf quality.
- Excellent Wear Resistance: Extends wire life in high-speed and high-load cutting conditions.
- Strict Oversize Control: Minimizes wire breakage risk and improves surface quality of cut materials.
- Low Elongated and Flake Content: Maximizes the proportion of effective cutting grains.
WSD – Diamond Powder for Wire Saw
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
WSD is a high-performance diamond powder developed specifically for diamond wire saw applications requiring stable cutting, long service life, and consistent performance. Produced from high-strength synthetic diamond feedstock, this grade features blocky and uniform crystal morphology with a concentrated particle size distribution, ensuring high cutting efficiency and reliable wire stability in precision cutting of brittle and hard materials.
Features
Specifications
| Available Grit Size Table (Special Series) | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Item | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 |
| PCDM | 1–2 | 0.5–3 | 1–3 | 1.5–3 | 2–3 | 2–4 | 2–5 | 3–6 | 3–7 | 4–8 | 4–9 | 5–10 | 5–12 | 6–12 | 8–12 | 8–16 |
| 8–20 | 10–20 | 12–22 | 12–25 | 15–25 | 16–26 | 20–30 | 22–36 | 20–40 | 30–40 | 25–45 | 30–50 | 40–50 | 36–54 | 40–60 | ||
| WSD | 4–8 | 5–10 | 6–12 | 8–12 | 8–16 | 10–20 | 20–30 | 30–40 | 35–45 | 40–50 | ||||||
Applications
Semiconductor
Designed for high-precision slicing of semiconductor materials.
- Monocrystalline and polycrystalline silicon wafer cutting
- Sapphire substrate slicing
- Semiconductor crystal processing
Optical & Optoelectronic
Used for precision cutting of optical and electronic crystal materials.
- Sapphire and optical crystal cutting
- Precision slicing of optoelectronic substrates
- High-quality wafer preparation
Glass & Gemstone
Suitable for cutting hard and brittle glass-based materials.
- LCD glass precision cutting
- Quartz substrate slicing for electronic applications
- Crystal material processing