- Spherical / Near-Spherical Particle Shape: Enables uniform dispersion and efficient packing in composite matrices.
- High Specific Surface Area: Improves contact area and bonding strength with metal or polymer matrices.
- Excellent Thermal Conductivity: Maximizes heat transfer efficiency in thermal management systems.
- Low Interfacial Thermal Resistance: Reduces heat loss at material interfaces.
- Good Flowability and Fillability: Supports easy processing and consistent composite formulation.
- High Chemical and Thermal Stability: Maintains performance under high temperature and harsh operating conditions.
STCD – Spherical Thermal Conductive Diamond
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
STCD is a spherical thermal conductive diamond powder developed for advanced thermal management applications requiring ultra-high heat dissipation and material stability. Featuring regular spherical or near-spherical diamond particles, this grade delivers excellent dispersion, low interfacial thermal resistance, and strong matrix bonding, making it ideal for high-performance heat sinks and thermally conductive composite systems used in electronics and semiconductor
Features
Specifications
The particle size range is 20–600 μm and can be customized according to customer requirements.
Applications
Thermal Management
Widely used in high-performance thermal solutions requiring efficient heat dissipation.
- Diamond/copper heat sinks for power electronics
- Diamond/aluminium heat spreaders
- High-power electronic cooling components
Semiconductor
Applied in thermal control of advanced semiconductor devices.
- Heat dissipation materials for power devices
- Thermal substrates and packaging systems
- High-frequency and high-power chip cooling
Optical & Optoelectronic
Suitable for thermal management of optoelectronic systems.
- Laser and optical module heat spreaders
- High-stability optoelectronic packaging
- Precision thermal control components