- Self-Sharpening Polycrystalline Structure: Enables controlled micro-fracture at crystal boundaries, continuously generating new cutting edges during polishing.
- Stable and Efficient Material Removal: Maintains consistent cutting performance over time, reducing polishing cycles and process variation.
- Excellent Surface Finish: Produces finer, more uniform scratch patterns with reduced subsurface damage.
- Good Dispersion Stability: Ensures uniform diamond distribution in the slurry, minimizing agglomeration during processing.
- Customizable Formulation: Slurry composition can be adjusted to meet specific grinding and polishing requirements.
Polycrystalline Diamond Slurry
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
Polycrystalline Diamond Slurry (PCDS) is a high-performance polishing slurry formulated by dispersing self-produced polycrystalline diamond (PCD) powder into water- or oil-soluble carrier liquids using precise scientific proportioning. The polycrystalline microstructure provides excellent self-sharpening behavior, enabling stable cutting action, high material removal efficiency, and superior surface finish. PCDS is designed for precision grinding and polishing applications where consistent performance, low scratch rate, and process reliability are required.
Features
Specifications
- Product Form: Polycrystalline Diamond Slurry (PCDS) with diamond abrasives uniformly dispersed in a liquid carrier.
- Diamond Type: Polycrystalline diamond powder with good self-sharpening and controlled particle size.
- Carrier System: Water-based and oil-based formulations available.
- Dispersion Stability: Stable suspension with low sedimentation during use.
- Customization: Diamond concentration, particle size, viscosity, and additives can be customized.
| Model | Particle Size | Water Base | Oil Base |
|---|---|---|---|
| PCDS-6U | 6 µm | PCDS-6U-W | PCDS-6U-O |
| PCDS-4U | 4 µm | PCDS-4U-W | PCDS-4U-O |
| PCDS-3U | 3 µm | PCDS-3U-W | PCDS-3U-O |
| PCDS-2U | 2 µm | PCDS-2U-W | PCDS-2U-O |
| PCDS-1U | 1 µm | PCDS-1U-W | PCDS-1U-O |
| PCDS-500N | 0.5 µm | PCDS-500N-W | PCDS-500N-O |
| PCDS-250N | 0.25 µm | PCDS-250N-W | PCDS-250N-O |
| PCDS-200N | 0.2 µm | PCDS-200N-W | PCDS-200N-O |
| PCDS-100N | 0.1 µm | PCDS-100N-W | PCDS-100N-O |
| PCDS-50N | 0.05 µm | PCDS-50N-W | PCDS-50N-O |
Applications
Semiconductor
Used for ultra-precision polishing processes requiring low damage and stable material removal.
- Wafer surface finishing and planarization
- Polishing of silicon and compound semiconductor materials
- Advanced device substrate preparation
Optical & Optoelectronic
Designed for high-quality surface finishing of optical and optoelectronic components.
- Optical glass and crystal polishing for high-clarity surfaces
- Laser and optoelectronic component finishing
- Low-scratch, high-clarity surface preparation
Ceramic Manufacturing
Suitable for controlled polishing and finishing of hard and brittle ceramic materials
- Advanced technical and structural ceramics
- Ceramic substrates and precision functional components
- Low-damage surface refinement for improved flatness and consistency