- Polycrystalline-Like Structure: Mimics polycrystalline behaviour through micro-fracturing during use.
- Self-Sharpening Performance: Continuously generates new cutting edges to maintain stable efficiency.
- Rough Particle Surface: Enhances material removal while reducing polishing pressure.
- Reduced Surface Scratching: Supports improved surface finish and lower workpiece damage.
- Cost-Effective Solution: Delivers high performance with excellent value for industrial use.
- Wide Size Availability: Fine to coarse sizes support both precision and high-load applications.
PLLM – Polycrystalline-like Diamond Powder
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
PLLM is a polycrystalline-like diamond micron powder developed as a cost-effective alternative to traditional polycrystalline diamond (PLDM). Engineered to deliver strong cutting efficiency and stable surface quality, this grade combines self-sharpening behavior with clean cutting performance, making it suitable for precision grinding, lapping, and polishing applications where both performance and cost control are required.
Features
Specifications
| Model | D10 (µm) | D50 (µm) | D95 (µm) | Application |
|---|---|---|---|---|
| PLLM 1/8 | ≥0.06 | 0.10–0.14 | ≤0.21 | End surface polishing of optical crystal, ultra-hard ceramic, wafer substrate, and metal. |
| PLLM 1/4 | ≥0.11 | 0.20–0.25 | ≤0.40 | |
| PLLM 0-1 | ≥0.40 | 0.48–0.55 | ≤0.72 | |
| PLLM 0-2 | ≥0.70 | 0.90–1.10 | ≤1.50 | |
| PLLM 2-4 | ≥1.80 | 2.70–3.00 | ≤4.50 | Lapping, rough polishing, and back thinning of sapphire and wafer substrate. |
| PLLM 3-6 | ≥2.80 | 4.00–4.40 | ≤7.00 | |
| PLLM 4-8 | ≥4.00 | 5.50–6.00 | ≤8.60 | |
| PLLM 5-9 | ≥4.70 | 6.30–7.00 | ≤10.00 | |
| PLLM 5-12 | ≥5.20 | 7.20–7.80 | ≤13.00 |
Applications
Semiconductor
Used for precision polishing of advanced semiconductor materials.
- Sapphire wafer polishing
- Silicon and silicon carbide (SiC) finishing
- GaN and related substrate processing
Optical & Optoelectronic
Suitable for fine polishing of optical and optoelectronic components.
- Optical glass surface finishing
- Precision mirror-finish polishing
- High-smoothness component preparation
Ceramic Manufacturing
Applied in grinding and polishing of hard and brittle ceramic materials.
- Advanced ceramic surface finishing
- Precision polishing of ceramic substrates
- Fine grinding applications