- Polycrystalline Micro-Granular Structure: Randomly oriented nanocrystals eliminate cleavage planes and provide exceptional toughness.
- Extremely High Toughness: Withstands polishing pressures up to three times higher than monocrystalline diamond.
- Rough Multi-Contact Particle Surface: Increases contact points with the workpiece for efficient and uniform material removal.
- Excellent Self-Sharpening Performance: Continuous micro-chipping generates new cutting edges for long-lasting efficiency.
- Fine Particle Size Range: Optimized for precision finishing with reduced scratch risk and high surface integrity.
PLDM – Polycrystalline Diamond Powder
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
PLDM is a polycrystalline diamond powder produced by detonation synthesis, designed for high-precision grinding, lapping, and polishing applications requiring extreme toughness and stable cutting performance. Featuring a polycrystalline micro-granular structure without cleavage planes, this grade withstands significantly higher working pressure than monocrystalline diamond while delivering high material removal efficiency and superior surface quality.
Features
Specifications
| Model | D10 (µm) | D50 (µm) | D95 (µm) | Application |
|---|---|---|---|---|
| PLDM 1/8 | ≥0.06 | 0.10–0.14 | ≤0.21 | End surface polishing of optical crystal, ultra-hard ceramic, wafer substrate, and metal. |
| PLDM 1/4 | ≥0.11 | 0.20–0.25 | ≤0.40 | |
| PLDM 0-1 | ≥0.40 | 0.48–0.55 | ≤0.72 | |
| PLDM 0-2 | ≥0.70 | 0.90–1.10 | ≤1.50 | |
| PLDM 2-4 | ≥1.80 | 2.70–3.00 | ≤4.50 | Lapping, rough polishing, and back thinning of sapphire and wafer substrate. |
| PLDM 3-6 | ≥2.80 | 4.00–4.40 | ≤7.00 | |
| PLDM 4-8 | ≥4.00 | 5.50–6.00 | ≤8.60 | |
| PLDM 5-9 | ≥4.70 | 6.30–7.00 | ≤10.00 | |
| PLDM 5-12 | ≥5.20 | 7.20–7.80 | ≤13.00 |
Applications
Semiconductor
Applied in high-precision polishing of semiconductor-related hard materials.
- Sapphire substrate finishing
- Silicon carbide (SiC) polishing process
- High-smoothness surface preparation
Optical & Optoelectronic
Ideal for high-precision polishing of optical and optoelectronic materials requiring scratch-free surfaces.
- Optical glass and lens polishing
- Sapphire and optical crystal surface finishing
- High-precision optical component polishing
Composite Materials
Used for controlled grinding and polishing of composite materials with stable surface quality.
- Fiber-reinforced composite polishing
- Hard–soft composite surface finishing
- Precision composite material processing