Nano Diamond Slurry
Nano Diamond Slurry
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Nano Diamond Slurry

20+ Years Experience Ultra-Precision Quality Customized Solutions
NDS (Nano Diamond Slurry) is a high-performance polishing slurry formulated by uniformly dispersing nano-scale diamond abrasives into a carefully engineered liquid carrier. With excellent dispersion stability and uniform particle distribution, NDS delivers higher and more consistent material removal efficiency than conventional polishing liquids. It is designed for ultra-precision polishing applications where superior surface quality, low defect levels, and process stability are critical, especially for hard and brittle materials.
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Features

  • Excellent Dispersibility & Stability: Uniform nano diamond distribution supports long-term suspension with minimal settling.
  • High and Stable Removal Rate: Maintains consistent polishing speed and efficiency across extended runs.
  • Superior Surface Quality: Delivers ultra-smooth finishes with low roughness and tight surface control.
  • Broad Material Compatibility: Suitable for semiconductor substrates, optical crystals, hard alloys, and metallographic samples.
  • Environmentally Friendly Formulation: Designed for clean processing with reduced environmental impact.

Specifications

Product Appearance Particle Size Range Abrasive Type Packaging Options
Nano Diamond Slurry (NDS) Dark Grey 30 nm – 500 nm HND, DND or mixed abrasives 500 mL, 1 L, 5 L, 25 L (custom available)
Note: Particle size, concentration, viscosity, pH value, and formulation parameters can be customised to meet specific process requirements.

Applications

Semiconductor

Ultra-precision wafer and substrate polishing.

  • Silicon, SiC, and compound semiconductor wafer polishing
  • CMP and final finishing
  • Low roughness and tight TTV control
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Optical & Optoelectronic

Applied in fine polishing of optical and crystalline materials.

  • Optical glass and crystal polishing
  • Laser and optoelectronic component surface finishing
  • High-quality surface preparation with minimal subsurface damage
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Cemented Carbides

Suitable for precision polishing of hard alloy materials.

  • Tungsten carbide and hard alloy surface finishing
  • Metallographic sample preparation
  • High-precision polishing of wear-resistant components
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