- Monocrystalline Diamond Structure: Ensures minimal lattice defects and stable thermal performance.
- Extremely Low Impurity Content: Reduces phonon scattering and maximizes thermal conductivity.
- Excellent Thermal Stability: Maintains performance under high temperature and high-power operation.
- Low Interfacial Thermal Resistance: Surface purification improves heat transfer efficiency at interfaces.
- High Hardness and Wear Resistance: Supports long service life in demanding environments.
- Wide Particle Size Range: Suitable for diverse thermal management design requirements.
MTCD – Monocrystalline Thermally Conductive Diamond
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
MTCD is a monocrystalline thermally conductive diamond powder developed for high-end thermal management applications requiring ultra-low thermal resistance and long-term reliability. Produced from high-purity monocrystalline diamond with minimal lattice defects and extremely low internal impurity content, MTCD delivers outstanding thermal conductivity, excellent thermal stability, and strong mechanical durability. Surface purification treatment further enhances thermal interface performance, making it ideal for advanced thermal interface materials in high-power and high-frequency electronic systems.
Features
Specifications
The particle size range is 20 µm–6000 µm and can be customized according to customer requirements.
Applications
Thermal Management
Used in high-performance thermal solutions where efficient and reliable heat dissipation is critical.
- High-end thermal interface materials (TIMs)
- Heat spreaders and cooling layers
- High-power electronic thermal systems
Semiconductor
Applied in advanced semiconductor thermal control systems and packaging applications.
- Power device heat dissipation
- Chip packaging and substrate cooling
- High-frequency and high-power semiconductor applications
Optical & Optoelectronic
Suitable for thermal management of optoelectronic devices with high power density.
- LED and laser module heat dissipation
- Optoelectronic packaging systems
- Precision thermal control components
Aerospace
Used in thermal management of aerospace electronic systems requiring high reliability and stability.
- High-reliability electronic cooling
- Thermal control components for aerospace electronics
- Harsh-environment thermal solutions
Composite Materials
Used as a functional filler to enhance composite thermal conductivity.
- Thermally conductive polymer composites
- Advanced electronic encapsulation materials
- High-performance thermal composite systems