- Monocrystalline Diamond Abrasive: Uses single-crystal diamond particles to provide sharp cutting edges and consistent polishing behavior.
- Excellent Dispersion: Scientifically proportioned formulation ensures stable, uniform dispersion without sedimentation.
- Water- and Oil-Based Compatibility: Suitable for both aqueous and oily carrier systems to match different process requirements.
- Controlled Material Removal: Delivers predictable removal rates and stable surface quality during precision polishing.
- Wide Application Versatility: Well-suited for polishing hard materials such as carbides, ceramics, optical glass, and semiconductor substrates.
Monocrystalline Diamond Slurry
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
Monocrystalline Diamond Slurry (MDS) is a precision polishing slurry formulated by dispersing high-quality monocrystalline diamond powder into a carefully engineered liquid carrier. Featuring sharp single-crystal diamond particles with excellent cutting ability, MDS delivers controlled material removal, stable polishing performance, and consistent surface quality. With reliable dispersion and compatibility in both water-based and oil-based systems, MDS is widely used for fine grinding and polishing of hard and brittle materials where efficiency and surface integrity are critical.
Features
Specifications
- Product Form: Monocrystalline Diamond Slurry (MDS) with diamond abrasives uniformly dispersed in a liquid carrier.
- Diamond Type: High-purity monocrystalline diamond powder with controlled grit size.
- Carrier System: Available in water-based and oil-based formulations to suit different polishing processes.
- Dispersion Stability: Optimized formulation ensures good suspension stability and minimal sedimentation during use.
- Application Method: Designed for use in slurry-based polishing, lapping, and finishing equipment.
| Model | Particle Size | Water Base | Oil Base |
|---|---|---|---|
| MDS-6U | 6 µm | MDS-6U-W | MDS-6U-O |
| MDS-4U | 4 µm | MDS-4U-W | MDS-4U-O |
| MDS-3U | 3 µm | MDS-3U-W | MDS-3U-O |
| MDS-2U | 2 µm | MDS-2U-W | MDS-2U-O |
| MDS-1U | 1 µm | MDS-1U-W | MDS-1U-O |
| MDS-500N | 0.5 µm | MDS-500N-W | MDS-500N-O |
| MDS-250N | 0.25 µm | MDS-250N-W | MDS-250N-O |
| MDS-200N | 0.2 µm | MDS-200N-W | MDS-200N-O |
| MDS-100N | 0.1 µm | MDS-100N-W | MDS-100N-O |
Applications
Semiconductor
Primary application for ultra-precision material removal and surface preparation.
- Wafer lapping and polishing
- Substrate surface conditioning
- Precision planarization processes
Optical & Optoelectronic
Used where high surface quality and controlled scratch patterns are required.
- Optical glass and crystal polishing
- Lens and prism surface finishing
- Optoelectronic component preparation
Cemented Carbides
Applied in precision finishing of hard, wear-resistant materials.
- Tungsten carbide tool polishing
- Carbide inserts and components
- Dimensional and surface refinement