- High-Efficiency Lapping Performance: Improves removal rate and processing efficiency when used with B₄C and other abrasives.
- Excellent Dispersion Stability: Helps prevent abrasive settling for consistent grinding over extended cycles.
- Temperature Control: Provides effective cooling during grinding to reduce thermal stress on the workpiece.
- Improved Surface Quality: Reduces edge chipping and broken flakes while supporting a better surface finish.
- TTV Optimization: Helps achieve tighter total thickness variation (TTV) in double-sided lapping processes.
- Workpiece Protection: Gentle formulation minimizes surface damage and improves final appearance.
Lapping Agent
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
Lapping Agent is a high-quality, water-soluble and high-efficiency processing aid designed for precision lapping and double-sided grinding applications. Used in combination with abrasives such as boron carbide (B₄C), it enhances material removal efficiency while protecting the workpiece surface. Its optimized formulation helps achieve flat, smooth end faces with improved appearance, reduced damage, and better dimensional control during grinding and lapping processes.
Features
Specifications
| Model | Appearance | Specific Gravity | pH Value |
|---|---|---|---|
| LA-B-1 (A) | Transparent Liquid | 1.115 | 10.5 – 11.5 |
| LA-B-1 (B) | Yellow Liquid | 1.079 | 7.5 – 8.5 |
| LA-B-1 (A+B) | Yellowish Transparent Liquid | 1.102 | 10.5 – 11.5 |
Applications
Double-sided Lapping and Grinding
Optimized for double-sided lapping and precision grinding with boron carbide abrasives, delivering high flatness, low damage, and stable processing performance.
- Double-sided lapping of wafers and flat components
- Precision grinding with boron carbide abrasives
- High-flatness surface preparation with controlled damage and stability