- Controlled Nano/Sub-Micron Size Distribution: Precisely controlled nano to sub-micron particle sizes ensure stable and consistent performance.
- Extremely High Thermal Conductivity: Retains diamond’s intrinsic ultra-high thermal conductivity for efficient heat dissipation.
- High Crystallinity & Hardness: Provides excellent wear resistance and long-term durability.
- High Specific Surface Area: Nanoscale structure enhances interfacial interaction and bonding efficiency.
- Essential Surface Functionalization: Ensures stable dispersion and strong compatibility with polymers, metals, ceramics, and composite systems.
HND – HPHT NanoDiamond
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
HND (HPHT Nano and Sub-Micron Diamond Powder) is an advanced material produced from HPHT synthesised diamond crystals through controlled crushing, precision milling, and strict classification, delivering particle sizes from tens of nanometres to the sub-micron range. It combines diamond’s exceptional hardness, thermal conductivity, and chemical inertness with nanoscale advantages such as high surface area and enhanced interfacial activity. With proprietary deagglomeration and surface functionalisation, HND disperses uniformly in various matrices and serves as a high-performance additive for thermal management, ultra-precision polishing, and advanced composite applications.
Features
Specifications
| Item | 5nm | 10nm | 30nm | 50nm | 100nm | 250nm | 500nm |
|---|---|---|---|---|---|---|---|
| HND | ✓ | ✓ | ✓ | ✓ | |||
| DND | ✓ | ✓ | ✓ | ✓ | |||
| Note: Particle size and nano-diamond properties can be customised according to customer requirements. | |||||||
Applications
Semiconductor
Applied in ultra-precision polishing and advanced surface treatment processes.
- CMP polishing for silicon and SiC wafers
- Fine surface finishing with low subsurface damage
- Uniform polishing for advanced semiconductor substrates
Thermal Management
Applied as a functional filler to enhance heat dissipation in advanced thermal systems.
- Thermal interface materials and heat-conductive pastes
- High-thermal-conductivity composites
- Electronic and power device cooling materials
Composite Materials
Used to reinforce functional and structural composite materials with enhanced performance.
- Polymer and resin composite reinforcement
- Wear-resistant and functional coatings
- High-performance industrial composite materials