- Regular Near-Spherical Crystal Shape: Ensures smooth cutting action and reduced surface damage.
- High Purity: Minimizes impurities to maintain stable grinding performance.
- Low Brittleness: Reduces crystal fracture and supports consistent material removal.
- Improved Surface Finish: Optimized for precision grinding with lower scratch depth.
- Stable Particle Size Distribution: Supports uniform contact and controlled machining behavior.
GCDZ – Reshaped Crushed Diamond Powder
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
GCDZ is a reshaped crushed diamond powder designed for precision grinding and machining applications where surface quality and process stability are critical. Through controlled reshaping technology, this grade features a regular, near-spherical crystal geometry that reduces cutting impact, extends tool and workpiece life, and improves surface finish in fine machining operations.
Features
Specifications
Available Grit Sizes
- Ultra-Fine Grits (0–1μm):
Optimized for ultra-precision polishing, enabling ultra-smooth, low-defect surfaces through uniform polishing action and minimal scratch depth. - Fine Grits (1–10μm):
Suitable for fine polishing and controlled material removal, ensuring consistent surface quality and excellent process stability in high-end finishing applications. - Medium Grits (10–40μm):
Applied for precision grinding and intermediate polishing, delivering smooth cutting behavior, stable performance, and reduced surface damage. - Coarse Grits (40–60μm):
Used for pre-polishing and controlled stock removal, supporting uniform material removal while maintaining surface integrity for subsequent fine polishing stages.
Crushed Diamond Powder Size Table
| Size | 60/70 | 70/80 | 80/100 | 100/120 | 120/140 | 140/170 | 170/200 | 200/230 | 230/270 | 270/325 | 325/400 | 400/500 | 500/600 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GRVD | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ |
| GCD10 | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ |
| GCD20 | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ |
| GCD30 | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | |
| GCDZ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ |
Applications
Optical & Optoelectronic
Used in precision machining of optical and transparent materials with strict surface requirements.
- Optical glass grinding and polishing preparation
- Crystal and gemstone shaping
- High-precision contour processing
Cemented Carbides
Suitable for fine grinding of hard alloy materials where surface integrity is required.
- Cemented carbide precision grinding
- Tool edge finishing
- Wear-resistant component surface finishing
Semiconductor
Applied in precision grinding of advanced hard and brittle semiconductor materials.
- Silicon and silicon carbide machining
- Fine grooving and shaping
- High-precision surface preparation