- Regular Near-Spherical Crystal Shape: Promotes uniform polishing action and smooth, controlled material removal.
- Ultra-Narrow Particle Size Distribution: Minimizes scratch depth and ensures consistent surface quality.
- Ultra-Low Impurity Content: Reduces contamination risk in sensitive precision polishing processes.
- High Mechanical Strength: Provides excellent wear and impact resistance during extended polishing cycles.
- Superior Surface Finish Capability: Supports high-gloss, low-defect surface requirements.
GCDMZ – Spherical Micron Diamond Powder
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
GCDMZ is a premium spherical monocrystalline micron diamond powder engineered for ultra-precision grinding and polishing applications. Manufactured from high-strength HPHT synthetic diamond and refined through proprietary shaping technology, this grade features highly regular near-spherical crystals, ultra-narrow particle size distribution, and exceptional surface purity, enabling superior surface finish and process stability in high-end polishing operations.
Features
Specifications
Available Grit Sizes
- Ultra-Fine Grits (0–1μm):
Specifically developed for ultra-precision polishing, enabling minimal scratch depth and excellent surface integrity in optical, semiconductor, and high-end finishing applications. - Fine Grits (1–10μm):
Suitable for fine polishing and lapping of brittle and hard materials, delivering uniform material removal and high-gloss surface quality. - Medium Grits (10–40μm):
Applied for precision grinding and controlled polishing processes, ensuring smooth cutting behavior and consistent finish with reduced surface defects. - Coarse Grits (40–50μm):
Used for efficient material removal in pre-polishing stages, while maintaining stable polishing performance and controlled surface quality.
Comparison Table of Micron Diamond Powder Particle Size
| China Standard JB/T 17990-1790 |
US / International Standard ANSI B74-1981 |
Japan Standard Mesh JIS 6002-63 |
Median Size D50 (μm) |
|---|---|---|---|
| W0.2 | 0–0.2 | 80000 | 0.1 |
| W0.25 | 0–0.25 | 60000 | 0.11–0.20 |
| W0.5 | 0–0.5 | 30000 | 0.20–0.30 |
| W1 | 0–1 | 15000 | 0.6–0.8 |
| W1.5- | 0–2 | 13000 | 1.0 |
| W1.5 | 1–2 | 12000 | 1.1–1.3 |
| W2.5 | 1–3 | 10000 | 1.6–1.8 |
| W3 | 2–3 | 7000 | 1.9–2.1 |
| W3.5 | 2–4- | 6500 | 2.2–2.6 |
| W3.5 | 2–4 | 6000 | 2.6–3.0 |
| W4 | 2–5 | 5000 | 3.1–3.4 |
| W5 | 3–6 | 4000 | 3.5–4.5 |
| W6 | 4–6 | 3500 | 4.4–5.0 |
| W7 | 4–8 | 3000 | 5.0–6.0 |
| W10- | 4–9 | 2500 | 6.1–6.5 |
| W10 | 5–10 | 2000 | 6.5–7.3 |
| W10+ | 6–12 | 1800 | 7.3–8.3 |
| W12 | 8–12 | 1600 | 8.3–9.0 |
| W14 | 7–14 | 1500 | 9.1–10.5 |
| W14 | 8–16 | 1300 | 10.0–12.0 |
| W20- | 10–20 | 1200 | 12.5–15.0 |
| W20 | 12–22 | 1000 | 15.0–17.0 |
| W20+ | 15–25 | 800 | 18.0–20.0 |
| W28 | 20–30 | 700 | 20–23 |
| W28+ | 22–36 | 600 | 23–26 |
| W40- | 20–40 | 500 | 26–29 |
| W40 | 30–40 | 450 | 29–32 |
| W40+ | 35–45 | 400 | 32–36 |
| W50 | 36–54 | 37–43 | |
| 325/400 | 320 | 43–48 | |
| 270/325 | 280 | 48–55 | |
| 230/270 | 240 | 56–64 | |
| 200/230 | 200 | 65–73 |
Applications
Optical & Optoelectronic
Designed for high-precision polishing of optical and optoelectronic components.
- Optical glass and lens polishing
- High-accuracy surface finishing of optical elements
- Precision contour polishing
Semiconductor
Suitable for ultra-precision finishing of advanced semiconductor materials.
- Sapphire substrate polishing
- Silicon carbide (SiC) surface finishing
- High-integrity wafer preparation
Ceramic Manufacturing
Applied in fine grinding and polishing of advanced ceramic materials.
- Technical ceramic surface finishing
- Precision polishing of brittle ceramic components
- Ultra-fine grinding applications