- High-Toughness HPHT Diamond: Provides superior impact resistance and durability under high grinding loads.
- Blocky Crystal Morphology: Enhances mechanical anchoring and particle holding force in electroplated systems.
- Narrow Particle Size Distribution: Ensures uniform cutting action and consistent surface quality.
- Ultra-Low Impurity Content: Improves bonding reliability and long-term processing stability.
- Excellent Surface Finish Performance: Supports precision polishing with reduced surface and sub-surface damage.
GCDM30 – Electroplated Micron Diamond Powder
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
GCDM30 is a high-quality monocrystalline micron diamond powder specifically developed for electroplated diamond tools and other high-load grinding systems. Produced from high-toughness HPHT synthetic diamond through controlled crushing and milling, this grade features blocky crystal morphology, narrow particle size distribution, and ultra-low impurity content, delivering strong grain retention, stable cutting performance, and excellent surface finish in precision grinding and polishing applications.
Features
Specifications
Available Grit Sizes
-
Ultra-Fine Grits (0–1μm):
Suitable for precision polishing applications requiring excellent surface finish, supporting stable cutting behavior and reduced surface damage in electroplated systems. -
Fine Grits (1–10μm):
Designed for fine grinding and lapping, offering uniform cutting action, strong grain retention, and consistent surface quality under high-load conditions. -
Medium Grits (10–40μm):
Applied for precision and general-purpose grinding, ensuring reliable particle holding force and stable performance in electroplated diamond tools. -
Coarse Grits (40–60μm):
Used for high-load grinding and efficient material removal, delivering excellent impact resistance, durability, and controlled surface results.
Comparison Table of Micron Diamond Powder Particle Size
| China Standard JB/T 17990-1790 |
US / International Standard ANSI B74-1981 |
Japan Standard Mesh JIS 6002-63 |
Median Size D50 (μm) |
|---|---|---|---|
| W0.2 | 0–0.2 | 80000 | 0.1 |
| W0.25 | 0–0.25 | 60000 | 0.11–0.20 |
| W0.5 | 0–0.5 | 30000 | 0.20–0.30 |
| W1 | 0–1 | 15000 | 0.6–0.8 |
| W1.5- | 0–2 | 13000 | 1.0 |
| W1.5 | 1–2 | 12000 | 1.1–1.3 |
| W2.5 | 1–3 | 10000 | 1.6–1.8 |
| W3 | 2–3 | 7000 | 1.9–2.1 |
| W3.5 | 2–4- | 6500 | 2.2–2.6 |
| W3.5 | 2–4 | 6000 | 2.6–3.0 |
| W4 | 2–5 | 5000 | 3.1–3.4 |
| W5 | 3–6 | 4000 | 3.5–4.5 |
| W6 | 4–6 | 3500 | 4.4–5.0 |
| W7 | 4–8 | 3000 | 5.0–6.0 |
| W10- | 4–9 | 2500 | 6.1–6.5 |
| W10 | 5–10 | 2000 | 6.5–7.3 |
| W10+ | 6–12 | 1800 | 7.3–8.3 |
| W12 | 8–12 | 1600 | 8.3–9.0 |
| W14 | 7–14 | 1500 | 9.1–10.5 |
| W14 | 8–16 | 1300 | 10.0–12.0 |
| W20- | 10–20 | 1200 | 12.5–15.0 |
| W20 | 12–22 | 1000 | 15.0–17.0 |
| W20+ | 15–25 | 800 | 18.0–20.0 |
| W28 | 20–30 | 700 | 20–23 |
| W28+ | 22–36 | 600 | 23–26 |
| W40- | 20–40 | 500 | 26–29 |
| W40 | 30–40 | 450 | 29–32 |
| W40+ | 35–45 | 400 | 32–36 |
| W50 | 36–54 | 37–43 | |
| 325/400 | 320 | 43–48 | |
| 270/325 | 280 | 48–55 | |
| 230/270 | 240 | 56–64 | |
| 200/230 | 200 | 65–73 |
Applications
Optical & Optoelectronic
Suitable for precision machining of brittle optical materials.
- Optical glass grinding and polishing
- Optoelectronic component surface finishing
- High-accuracy contour processing
Semiconductor
Applied in fine grinding and polishing of advanced semiconductor substrates.
- Sapphire wafer polishing
- Silicon carbide (SiC) surface finishing
- Precision substrate preparation
Ceramic Manufacturing
Used for high-precision grinding and polishing of technical ceramics.
- Advanced ceramic surface finishing
- Precision grinding of hard ceramic components
- Fine polishing applications