- Highly Regular Blocky Crystal Shape: Ensures stable cutting behavior and improved tool life.
- High Crystal Strength: Provides excellent wear resistance and impact strength for demanding applications.
- Concentrated Particle Size Distribution: Delivers consistent performance and predictable surface quality.
- Strict Oversize Control: Minimizes surface scratching and supports fine polishing results.
- High Thermal Stability: Maintains performance under high-load and high-temperature processing conditions.
GCDM20 – Metal Bond Micron Diamond Powder
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
GCDM20 is a premium-grade monocrystalline micron diamond powder developed for metal bond and high-precision polishing applications requiring excellent wear resistance, thermal stability, and surface quality. Manufactured from high-strength HPHT synthetic diamond, this grade features highly regular blocky crystals and a concentrated particle size distribution, delivering consistent cutting behavior and superior finish in demanding grinding and polishing processes.
Features
Specifications
Available Grit Sizes
-
Ultra-Fine Grits (0–1μm):
Developed for final precision polishing, delivering excellent surface finish and minimal sub-surface damage for optical glass, semiconductor, and high-end polishing applications. -
Fine Grits (1–10μm):
Suitable for fine grinding and lapping, providing stable cutting behavior, uniform dispersion, and consistent surface quality in slurry and paste systems. -
Medium Grits (10–40μm):
Designed for precision grinding and controlled material removal, ensuring predictable performance, strong wear resistance, and extended tool life. -
Coarse Grits (40–50μm):
Used for efficient pre-polishing and higher stock removal, supporting stable cutting action while maintaining good surface finish control.
Comparison Table of Micron Diamond Powder Particle Size
| China Standard JB/T 17990-1790 |
US / International Standard ANSI B74-1981 |
Japan Standard Mesh JIS 6002-63 |
Median Size D50 (μm) |
|---|---|---|---|
| W0.2 | 0–0.2 | 80000 | 0.1 |
| W0.25 | 0–0.25 | 60000 | 0.11–0.20 |
| W0.5 | 0–0.5 | 30000 | 0.20–0.30 |
| W1 | 0–1 | 15000 | 0.6–0.8 |
| W1.5- | 0–2 | 13000 | 1.0 |
| W1.5 | 1–2 | 12000 | 1.1–1.3 |
| W2.5 | 1–3 | 10000 | 1.6–1.8 |
| W3 | 2–3 | 7000 | 1.9–2.1 |
| W3.5 | 2–4- | 6500 | 2.2–2.6 |
| W3.5 | 2–4 | 6000 | 2.6–3.0 |
| W4 | 2–5 | 5000 | 3.1–3.4 |
| W5 | 3–6 | 4000 | 3.5–4.5 |
| W6 | 4–6 | 3500 | 4.4–5.0 |
| W7 | 4–8 | 3000 | 5.0–6.0 |
| W10- | 4–9 | 2500 | 6.1–6.5 |
| W10 | 5–10 | 2000 | 6.5–7.3 |
| W10+ | 6–12 | 1800 | 7.3–8.3 |
| W12 | 8–12 | 1600 | 8.3–9.0 |
| W14 | 7–14 | 1500 | 9.1–10.5 |
| W14 | 8–16 | 1300 | 10.0–12.0 |
| W20- | 10–20 | 1200 | 12.5–15.0 |
| W20 | 12–22 | 1000 | 15.0–17.0 |
| W20+ | 15–25 | 800 | 18.0–20.0 |
| W28 | 20–30 | 700 | 20–23 |
| W28+ | 22–36 | 600 | 23–26 |
| W40- | 20–40 | 500 | 26–29 |
| W40 | 30–40 | 450 | 29–32 |
| W40+ | 35–45 | 400 | 32–36 |
| W50 | 36–54 | 37–43 | |
| 325/400 | 320 | 43–48 | |
| 270/325 | 280 | 48–55 | |
| 230/270 | 240 | 56–64 | |
| 200/230 | 200 | 65–73 |
Applications
Optical & Optoelectronic
Designed for high-precision polishing of optical and optoelectronic materials.
- Optical glass and lens polishing
- Finishing of optical components
- High-surface-quality contour polishing
Semiconductor
Suitable for final-stage polishing of advanced semiconductor materials.
- Sapphire substrate polishing
- Silicon carbide (SiC) surface finishing
- High-precision wafer preparation
Ceramic Manufacturing
Applied in fine polishing of advanced and technical ceramics.
- Technical ceramic surface finishing
- Precision polishing of hard ceramic components
- Ultra-fine grinding applications