ETCD – Etched Thermal Conductive Diamond

20+ Years Experience Ultra-Precision Quality Customized Solutions

ETCD is an etched thermal conductive diamond powder engineered for advanced thermal management applications where ultra-high heat dissipation and interface reliability are critical. Through controlled surface etching, this grade maintains diamond’s exceptional thermal conductivity while improving surface morphology and adhesion, resulting in lower interfacial thermal resistance and more efficient heat transfer in high-power electronic and semiconductor systems.

Features

Surface-Etched Diamond Structure: Optimized surface morphology improves mechanical interlocking and bonding efficiency in composite and interface materials.
Ultra-High Thermal Conductivity: Retains the intrinsic high thermal conductivity of diamond for efficient heat dissipation.
Reduced Surface Defects: Etching process minimizes surface impurities and defects, contributing to lower interfacial thermal resistance.
Enhanced Interfacial Adhesion: Improves bonding with metal matrices, polymers, and TIM systems for reliable thermal performance.
Low Interfacial Thermal Resistance: Enables faster heat transfer across interfaces, supporting high-power and high-density electronic applications.
High Thermal and Chemical Stability: Ensures long-term performance under elevated temperatures and demanding operating environments.

Specifications

The particle size range is 30 µm–540 µm and can be customized according to customer requirements.

Applications

Thermal Management

Widely used in high-performance thermal solutions requiring efficient and stable heat dissipation.

Heat spreaders and thermal interface materials (TIMs)
Microchannel coolers and advanced cooling structures
High-reliability thermal management components

Semiconductor

Applied in thermal control of advanced semiconductor devices with high power density.

Power semiconductor heat dissipation and spreading
Chip packaging and substrate cooling
High-frequency and high-power device applications

Optical & Optoelectronic

Used for thermal management of optoelectronic systems requiring stable temperature control.

LED heat dissipation components and substrates
Laser and optoelectronic module cooling solutions
Precision optoelectronic packaging systems

Composite Materials

Used as a functional filler in thermally conductive composites.

Metal matrix composites
High thermal conductivity polymer composites
Advanced thermal interface materials

Aerospace

Applied in thermal management of high-performance aerospace electronics.

High-power electronic cooling
Thermal control components
Harsh-environment thermal solutions

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