- Coated Diamond Surface: Uniform metal or non-metal coatings improve interfacial bonding with matrices.
- Enhanced Thermal Stability: Maintains high thermal performance under elevated temperatures.
- Reduced Interfacial Thermal Resistance: Improves heat transfer efficiency between diamond and substrate.
- High Thermal Conductivity: Retains the intrinsic thermal advantages of diamond.
- Multiple Coating Options: Ti, Cr, Cu, Al, Mo, Zr, W, Co, Si, CuSn, and CuCr available for different systems.
- Wide Particle Size Range: Supports flexible design of thermal solutions.
Coated Thermal Conductive Diamond
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
CTCD is a coated thermal conductive diamond powder engineered for advanced thermal management systems where low interfacial thermal resistance and strong bonding are required. With uniform metal or non-metal surface coatings applied to high-purity diamond particles, this grade enhances thermal stability and interface compatibility, making it suitable for heat spreaders, thermal interface materials, and metal matrix composites used in high-power electronics and semiconductor applications.
Features
Specifications
The particle size range is 30 µm–540 µm and can be customized according to customer requirements.
Applications
Thermal Management
Used in high-performance thermal systems requiring efficient heat spreading and reliable interfaces.
- Heat spreaders and thermal interface materials
- High-power electronic and 5G device cooling
- Advanced metal matrix thermal composites
Semiconductor
Applied in thermal control of semiconductor packaging and power devices.
- Chip packaging and substrate heat dissipation
- Power semiconductor thermal solutions
- High-density device thermal management
Composite Materials
Used as a functional filler to enhance thermal conductivity and interfacial heat transfer.
- Metal matrix composites for efficient heat spreading
- High-conductivity polymer and resin systems
- Structural thermal materials for electronic applications