- Bead-Shaped Agglomerated Morphology: Rounded granules reduce deep scratches and improve surface consistency on brittle materials.
- Isotropic Cutting Behavior: Uniform internal structure without cleavage planes ensures stable and predictable cutting force.
- Self-Renewing Micro-Edges: Controlled micro-fracturing continuously generates fresh cutting edges.
- High Wear Resistance: Balanced aggregate strength supports long tool life and stable performance.
- Tight Particle Size Distribution: Improves process control, pad life, and overall consistency.
- Customizable Aggregate Hardness and Size: Easily matched to specific slurry, pad, or bonded-tool formulations.
AMD-Agglomerated Diamond Powder
20+ Years Experience
Ultra-Precision Quality
Customized Solutions
AMD is an agglomerated diamond powder developed for precision grinding and polishing processes that require high material removal rates with a smooth and controlled scratch profile. Formed by controlled agglomeration of selected diamond particles into near-spherical granules, AMD delivers dense, evenly distributed cutting points, stable cutting forces, and excellent self-sharpening behavior, making it a practical and cost-effective alternative to polycrystalline and polycrystalline-like diamond powders in volume manufacturing.
Features
Specifications
| Item | Original Size (µm) | Finished Size (µm) | Product Mark |
|---|---|---|---|
| AMD (Agglomerated Diamond Powder) |
0.5 | 10 | AMD0510 |
| 1.5 | 22 | AMD1522 | |
| 1.5 | 32 | AMD1532 | |
| 1.5 | 46 | AMD1546 | |
| 3.0 | 35 | AMD3035 | |
| 4.0 | 45 | AMD4045 | |
| 7.0 | 75 | AMD7075 | |
| 7.0 | 125 | AMD70125 |
Applications
Semiconductor
Used in precision lapping and polishing of semiconductor materials.
- Sapphire, silicon, SiC, and GaN wafer thinning
- Edge polishing and fine surface preparation
- Stable, low-damage material removal
Optical & Optoelectronic
Suitable for high-quality polishing of optical and optoelectronic components.
- Optical glass and crystal polishing
- Precision surface finishing with low subsurface damage
- Controlled contour and form polishing
Ceramic Manufacturing
Applied in fine grinding and polishing of advanced ceramic materials.
- Functional and technical ceramic polishing
- Glass-ceramic surface finishing
- Precision lapping applications for ceramic components