AMD-Agglomerated Diamond Powder
Description: Agglomerated Diamond Powder (AMD) is a bead-shaped micron abrasive developed to deliver high removal rates with a smooth scratch profile. Each near-spherical granule provides dense, evenly distributed cutting points and renews micro-edges during use, reducing deep scratches while maintaining efficiency. Particle size and aggregate hardness can be tailored to your process.
What is AMD？
AMD is produced by controlled agglomeration of selected diamond particles into near-spherical granules with uniform internal structure. The aggregates behave isotropically with no fixed cleavage planes, offering steady cutting force, strong wear resistance and tight size control. During operation the granules micro-fracture in a controlled way, generating fresh cutting edges and keeping the process stable. Designed as a practical alternative to detonation polycrystalline and polycrystalline-like grades, AMD balances throughput, finish quality and cost for volume manufacturing.
Advantages of AMD
- Bead-Shaped Morphology: Rounded granules reduce the risk of deep scratches on brittle substrates.
- Isotropic Cutting Behaviour: No fixed cleavage planes for stable cutting force and consistent finish.
- Self-Renewing Micro-Edges: Controlled micro-fracture sustains high removal rates.
- High Wear Resistance: Uniform aggregate strength supports long, predictable performance.
- Tight Size Distribution & Oversize Control: Improves process stability and pad/tool life.
- Process-Ready & Customisable: Aggregate size and hardness can be matched to your slurry or fixed-abrasive recipe.
- Cost-Effective Alternative: Polycrystalline-like efficiency with a smoother scratch profile.
Typical Processing Applications
Production：Suitable for formulating diamond slurries, fixed-abrasive pads/films, and resin, metal or ceramic-bond tools where a fine, controlled scratch pattern is required.
Production：Suitable for high-performance bonded tools, electroplated tools, and PDC synthesis.
- Diamond Slurries: Used with polishing pads for sapphire and SiC wafers, functional ceramics and glass-ceramics.
- Polishing Pads & Fixed-Abrasive Media: Micro-crystalline glass covers, sapphire, SiC and other hard-brittle materials.
- Semiconductor & Electronics: Thinning, lapping and edge polishing of sapphire, Si, SiC and GaN.
- Precision Optics & Ceramics: High-efficiency lapping and polishing with low subsurface damage.
Available Size
