WSDM-Diamond Powder for Wire Saw
Description: Specially developed for diamond wire saw applications, this diamond micron powder is produced from high-strength diamond raw materils with blocky and uniform crystal morphology. It features tightly controlled particle size distribution, high wear resistance, and exceptional toughness. Oversized, elongated, and flake particles are strictly minimised to ensure maximum effective cutting edges and consistent wire stability. Available in customised size ranges suitable for wire saw production.
What is WSDM？
WSD(Diamond powder for Wire Saw) is engineered for precision cutting applications such as silicon wafers, sapphire substrates, quartz, and other brittle materials. With blocky crystals, narrow particle size distribution, and superior durability, DPWS delivers stable cutting, long wire life, and efficient material removal. Strict quality control ensures reliable performance in demanding production environments.
Advantages of WSDM
- High-Strength Diamond Feedstock: Ensures durability and long tool life.
- Blocky and Uniform Crystal Shape: Improves cutting stability and efficiency.
- Concentrated Particle Size Distribution: Guarantees consistent cutting performance.
- High Wear Resistance: Extends wire life under high-load cutting conditions.
- Strict Oversize Control: Reduces risk of wire breakage and surface damage.
- Minimal Elongated or Flake Particles: Ensures high proportion of effective cutting grains.
Typical Processing Applications
Production: Specifically designed for wire saw manufacturing and other high-precision cutting tools.
- Silicon Wafer Cutting: Monocrystalline and polycrystalline silicon.
- Sapphire and Crystal Cutting: For semiconductor and optical applications.
- LCD Glass and Quartz: Precision cutting of brittle electronic substrates.
- Magnetic Materials: Efficient slicing of hard magnetic materials.